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1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability

Λεπτομέρειες προϊόντος:
Τόπος καταγωγής: ΓΚΟΥΑΝΚΝΤΟΝΓΚ, ΚΙΝΑ
Μάρκα: Hanast
Πιστοποίηση: ROHS
Αριθμό μοντέλου: HN-100
Λεπτομέρειες
Τόπος καταγωγής:
ΓΚΟΥΑΝΚΝΤΟΝΓΚ, ΚΙΝΑ
Μάρκα:
Hanast
Πιστοποίηση:
ROHS
Αριθμό μοντέλου:
HN-100
Επισημαίνω:

High Light

Επισημαίνω:

Extreme Heat Dissipation Thermal Compound Paste

,

High Durability Thermal Compound Paste

,

1.0W/M·K Thermal Compound Paste

Πληροφορίες συναλλαγών
Ποσότητα παραγγελίας min:
1 κιλό
Τιμή:
USD
Συσκευασία λεπτομέρειες:
25kg/βάρελ
Χρόνος παράδοσης:
5-8 μέρες
Όροι πληρωμής:
D/a, d/p, t/t
Περιγραφή του προϊόντος

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability

 

Product description:

 

High thermal conductivity and insulating organic silicon material, which almost never solidifies, can remain in a paste-like
state for long-term use at temperatures ranging from -40℃ to +180℃.
 
It possesses excellent electrical insulation properties, outstanding thermal conductivity, along with a low degree of impurities
(tending towards zero), and is resistant to high and low temperatures, water, ozone, and climate aging.

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability 0
1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability 1
Product application:
This type of silicon material provides excellent thermal conductivity for electronic components that generate heat. For
example: transistors, CPU assemblies, thermistors, temperature sensors, automotive electronic components, automotive
refrigerators, power modules, printer heads, etc.
 
Heat dissipation interfaces for LED lamps, power templates, electrical components for various heat dissipation and heat
transfer purposes.
1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability 2
Model
HN100
HN150
HN250
HN300
Appearence
White/gray
paste-like
substance
White, gray
paste-like
substance
gray paste-like
substance
Shiny, smooth
graypaste-like
substance
Thermal
conductivity
(w/m.k)
1.0
1.5
2.5
3.0
Density (g/cm³)
1.85± 0.08
2.77 ± 0.08
3.1 ± 0.08
2.5 ± 0.08
Oil separation
(at 200℃, for 24
hours)
≤0.3%
≤0.4%
≤0.5%
≤0.3%
Volatile matter
(at 200℃, for 24
hours)
≤0.6%
≤0.8%
≤0.8%
≤0.7%

 

Packing:
1KG/Can
5KG/Barrel
 

Technology service

Provide complete product technical documentation;

Adjust the product formula according to customer requirements to meet their specific performance demands for the product;

Our company welcomes users to collaborate with our engineers, communicate and jointly explore solutions.
Shelf Life
(1) Store in a cool and dry place, away from direct sunlight. It is recommended to keep the temperature below 27℃.
(2) When unopened and sealed properly, it can be stored for 12 months.
(3) During storage, a small amount of silicone oil may precipitate. This is normal and does not affect usage. If necessary, stir
evenly
before use.

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability 3

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability 4

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability 5

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability 6

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability 7