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1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability

Name: 1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-100
Availability: InStock

Produktdetails:

Herkunftsort:	GUANGDONG, CHINA
Markenname:	Hanast
Zertifizierung:	ROHS
Modellnummer:	HN-100

Einzelheiten

Herkunftsort:

GUANGDONG, CHINA

Markenname:

Hanast

Zertifizierung:

ROHS

Modellnummer:

HN-100

Hervorheben:

High Light

Hervorheben:

Extreme Heat Dissipation Thermal Compound Paste

High Durability Thermal Compound Paste

1.0W/M·K Thermal Compound Paste

Handelsinformationen

Min Bestellmenge:

1kg

Preis:

USD

Verpackung Informationen:

25 kg/Fass

Lieferzeit:

5-8 Tage

Zahlungsbedingungen:

D/a, d/p, t/t

Beschreibung des Produkts

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability Product description: High thermal conductivity and insulating organic silicon material, which almost never solidifies, can remain in a paste-like state for long-term use at temperatures ranging from -40℃ to +180℃. It possesses excellent electrical insulation properties, outstanding thermal conductivity, along with a low degree of

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Powdered Thermal Paste for Constant Temperature Oven 200 Degrees Breakdown Voltage of 2450 After 8 Days of Continuous Baking

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Einheiten 1210-1211, Block B, Gebäude 6, Hengda Fashion Valley, Dalang Street, Bezirk Longhua, Shenzhen, Provinz Guangdong, China E-mail: sales11@hanastsilicone.com Tel: +8613670122311 Tel: +8613670122311

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1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability

High Light

Hervorheben:

Extreme Heat Dissipation Thermal Compound Paste

High Durability Thermal Compound Paste

1.0W/M·K Thermal Compound Paste

GPU Thermal Conductive Grease,

3.0 W/MK Thermal Conductive Grease,

Easy To Apply Thermal Conductive Grease

Thermal Grease 0.97± 0.1 Thermal Conductivity Viscosity 76 Density 1.85± 0.08 For Customer Requirements

Powdered Thermal Paste for Constant Temperature Oven 200 Degrees Breakdown Voltage of 2450 After 8 Days of Continuous Baking