25 kg/beczka, 200 kg/bęben lub opakowanie niestandardowe
Czas dostawy:
3-7 dni roboczych
Zasady płatności:
T/T, D/A, D/P
Możliwość Supply:
5000 kg miesięcznie
Opis produktu
Waterproof Clear Epoxy Potting Compound 5:1 Two Component Encapsulant for Underwater Electronics HN-5508AB is a clear two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for underwater electronics, marine equipment and water-exposed electronic module encapsulation . It combines UL 94 V-0 flame retardancy, excellent thermal shock resistance, high dielectric strength and low water absorption, protecting sensitive circuits from moisture ingress and