OEM Silicone Black Epoxy Potting Compound Resin Glue 5:1 For Electrical Led Driver High Hardness Potting Glue
HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness
Features
Flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, low-temperature resistance.
Applications
HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high-voltage packs,
aquarium equipment, anion generators, ultrasonic atomizers, and electronics
efore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
pigment | Black / White et al | Ruburn / transparent surface |
| | A sticky epoxy resin water | r liquid specific |
c gravity, g / cm3 | 1.4-1.5 | 1.05 |
Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage |
e Period (25℃) | Six months | x months |
processabili | mixing ratio | A: B =5:1 (weight ratio) |
Available for a time of 25℃ | 2-3H (100g mix) |
curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
After curing | 2 Tensile strength of kg/cm | 16-18 |
2 Compressive strength of kg/cm | 18-22 |
Resistance to the voltage of kv/mm | 20-22 |
Surface resistance ofΩ-cm | 14 1.2*10 |
Volume resistance ofΩ-cm | 15 1.1*10 |
contraction percentage% | 0.35-0.55 |
Water absorption rate was 25℃ * 24H | <0.03% |
The hardness of SHORE A | 85-95 |
distortion temperature ℃ | 130-150 |
low temperature resistant ℃ | -30 |
1. This product is an AB agent, according to the label ratio on the product package, and the mixing ratio is weight ratio and non-volume ratio.
2, AB agent mixing can not be stirred with a round bar without resistance, must be stirred with a flat tool with resistance, it is best to use a small mixer.
3. This product should be placed in a cool and dry place to avoid light, keep the workshop dust-free, and cover the unused glue after opening the lid in time.
4. The performance test data is the test result when the humidity is 60% and the temperature is 25℃, for customer reference only.
5, resin glue stored in a wet environment will exhibit a crystallization phenomenon, please put it in the oven at a low temperature hot dry, and restore its original state.
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