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Home > Products >
Epoxy Potting Compound
>
Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors
All Category

Tin Cure Silicone Rubber

Platinum Cure Silicone Rubber

Clear Liquid Silicone

Food Safe Liquid Silicone

Electronic Silicone Gel

Squishy Silicone Gel

Silicone Potting Compound

Epoxy Potting Compound

Polyurethane Potting Compound

Thermally Conductive Potting Compound

Silicone Pigment

Degumming Agent
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name
  • name
  • name

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

Brand Name: Hanast
Model Number: HN-5508AB
MOQ: 1kg
Price: Negotiable
Packaging Details: 25kgs/barrel
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Place of Origin:
Guangdong,China
Certification:
ROHS SGS
Feature:
Flame Retardant Insulation, Sealing Bonding, Moisture-proof
Waterproof:
Yes
Consist:
Epoxy Resin A, Curing Agent B
Hardness Shore A:
85-95
Viscosity:
Low Viscosity
Appearance:
A Sticky Epoxy Resin Water,liquid
Mixing Ratio:
A: B =5:1 (weight Ratio)
Water Absorption Rate Was 25℃ * 24H:
<0.03%
Low Temperature Resistant ℃:
-30
Shelf Time:
6 Months (25℃)
Highlight:

Heat Curing Epoxy Potting Compound

,

Epoxy Potting Compound material

,

Silicone epoxy potting material

Product Description

85 Hardness Silicone For Encapsulation Connectors 5:1 Epoxy Potting Glue Black Color For Transformer Resistors 2 Components Potting Compound Material

 

Product descriptions:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product

 

Product features:

Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation

Before curing

builder

Epoxy resin 5508

Curing agent 5508

pigment

Black / White et al

Ruburn / transparent surface
 

A sticky epoxy resin water

r liquid specific

c gravity, g / cm3

1.4-1.5

1.05

Viscosity of 25℃

4,500—6,000cp s

150—250cp storage

e Period (25℃)

Six months

x months

 

processabili

 

mixing ratio

A: B =5:1 (weight ratio)

Available for a time of 25℃

2-3H (100g mix)

curing time

25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H

After curing

2 Tensile strength of kg/cm

16-18

2 Compressive strength of kg/cm

18-22

Resistance to the voltage of kv/mm

20-22

Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage%

0.35-0.55

Water absorption rate was 25℃ * 24H

<0.03%

 

The hardness of SHORE A

85-95

distortion

temperature ℃

130-150

low temperature resistant ℃

-30

Application:

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 0

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 1

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2

Tags: 

epoxy potting material  

bulk liquid silicone  

epoxy resin potting compound

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Good price online

Products Details

Home > Products >
Epoxy Potting Compound
>
Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors
All Category

Tin Cure Silicone Rubber

Platinum Cure Silicone Rubber

Clear Liquid Silicone

Food Safe Liquid Silicone

Electronic Silicone Gel

Squishy Silicone Gel

Silicone Potting Compound

Epoxy Potting Compound

Polyurethane Potting Compound

Thermally Conductive Potting Compound

Silicone Pigment

Degumming Agent
name
  • name
  • name

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

Brand Name: Hanast
Model Number: HN-5508AB
MOQ: 1kg
Price: Negotiable
Packaging Details: 25kgs/barrel
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Place of Origin:
Guangdong,China
Brand Name:
Hanast
Certification:
ROHS SGS
Model Number:
HN-5508AB
Feature:
Flame Retardant Insulation, Sealing Bonding, Moisture-proof
Waterproof:
Yes
Consist:
Epoxy Resin A, Curing Agent B
Hardness Shore A:
85-95
Viscosity:
Low Viscosity
Appearance:
A Sticky Epoxy Resin Water,liquid
Mixing Ratio:
A: B =5:1 (weight Ratio)
Water Absorption Rate Was 25℃ * 24H:
<0.03%
Low Temperature Resistant ℃:
-30
Shelf Time:
6 Months (25℃)
Minimum Order Quantity:
1kg
Price:
Negotiable
Packaging Details:
25kgs/barrel
Payment Terms:
T/T
Highlight:

Heat Curing Epoxy Potting Compound

,

Epoxy Potting Compound material

,

Silicone epoxy potting material

Product Description

85 Hardness Silicone For Encapsulation Connectors 5:1 Epoxy Potting Glue Black Color For Transformer Resistors 2 Components Potting Compound Material

 

Product descriptions:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product

 

Product features:

Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation

Before curing

builder

Epoxy resin 5508

Curing agent 5508

pigment

Black / White et al

Ruburn / transparent surface
 

A sticky epoxy resin water

r liquid specific

c gravity, g / cm3

1.4-1.5

1.05

Viscosity of 25℃

4,500—6,000cp s

150—250cp storage

e Period (25℃)

Six months

x months

 

processabili

 

mixing ratio

A: B =5:1 (weight ratio)

Available for a time of 25℃

2-3H (100g mix)

curing time

25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H

After curing

2 Tensile strength of kg/cm

16-18

2 Compressive strength of kg/cm

18-22

Resistance to the voltage of kv/mm

20-22

Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage%

0.35-0.55

Water absorption rate was 25℃ * 24H

<0.03%

 

The hardness of SHORE A

85-95

distortion

temperature ℃

130-150

low temperature resistant ℃

-30

Application:

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 0

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 1

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2

Tags: 

epoxy potting material

bulk liquid silicone

epoxy resin potting compound

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ODM 3:1 Clear Resin Epoxy Potting Compound Glue For LED Driver 2 Parts Video

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Thermally Conductive Black Potting Compound Epoxy Resin Glue Material Low Viscosity Video

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2:1 Electrically Conductive RTV Epoxy Potting Compound For Transformers Fire Retardant High Temp Video

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