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Electronic Raw Silicone Material Low Viscosity Potting Compound Glue 2 Component

Electronic Raw Silicone Material Low Viscosity Potting Compound Glue 2 Component

Brand Name: Hanast
Model Number: HN-5508AB
MOQ: 1kg
Price: Negotiable
Packaging Details: 25KG/barrel
Payment Terms: T/T
Detail Information
Place of Origin:
Guangdong, China
Certification:
ROHS SGS
Feature:
High Hardness 85-95 Shore A
Sample:
Can Be Offered
Keyword:
Epoxy Resin Ab Glue For Electronic Potting
Color:
Black
Application:
Temperature Controllers Sensors Led Driver
Mix Ratio:
5:1
Highlight:

2 Component raw silicone material

,

Potting raw silicone material

,

Silicone low viscosity potting compound

Product Description

Temperature Controllers Sensors Potting Glue For Electronic 5:1 Black Epoxy Resin Heat Proof two component Potting Ab Glue

 

Product Description:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation, compressive resistance, and bonding strength. 

 

Product Application:

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high-voltage packs,
aquarium equipment, anion generators, ultrasonic atomizers, and electronics

uring builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
  A sticky epoxy resin water r liquid specific
c gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
e Period (25℃) Six months x months

 

processabili

 

mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing 2 Tensile strength of kg/cm 16-18
2 Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%

 

The hardness of SHORE A 85-95

distortion

temperature ℃

130-150
low temperature resistant ℃ -30

 

Electronic Raw Silicone Material Low Viscosity Potting Compound Glue 2 Component 0

Electronic Raw Silicone Material Low Viscosity Potting Compound Glue 2 Component 1

Good price  online

Products Details

Home > Products >
Epoxy Potting Compound
>
Electronic Raw Silicone Material Low Viscosity Potting Compound Glue 2 Component

Electronic Raw Silicone Material Low Viscosity Potting Compound Glue 2 Component

Brand Name: Hanast
Model Number: HN-5508AB
MOQ: 1kg
Price: Negotiable
Packaging Details: 25KG/barrel
Payment Terms: T/T
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
Hanast
Certification:
ROHS SGS
Model Number:
HN-5508AB
Feature:
High Hardness 85-95 Shore A
Sample:
Can Be Offered
Keyword:
Epoxy Resin Ab Glue For Electronic Potting
Color:
Black
Application:
Temperature Controllers Sensors Led Driver
Mix Ratio:
5:1
Minimum Order Quantity:
1kg
Price:
Negotiable
Packaging Details:
25KG/barrel
Payment Terms:
T/T
Highlight:

2 Component raw silicone material

,

Potting raw silicone material

,

Silicone low viscosity potting compound

Product Description

Temperature Controllers Sensors Potting Glue For Electronic 5:1 Black Epoxy Resin Heat Proof two component Potting Ab Glue

 

Product Description:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation, compressive resistance, and bonding strength. 

 

Product Application:

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high-voltage packs,
aquarium equipment, anion generators, ultrasonic atomizers, and electronics

uring builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
  A sticky epoxy resin water r liquid specific
c gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
e Period (25℃) Six months x months

 

processabili

 

mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing 2 Tensile strength of kg/cm 16-18
2 Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%

 

The hardness of SHORE A 85-95

distortion

temperature ℃

130-150
low temperature resistant ℃ -30

 

Electronic Raw Silicone Material Low Viscosity Potting Compound Glue 2 Component 0

Electronic Raw Silicone Material Low Viscosity Potting Compound Glue 2 Component 1