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Epoxy Potting Compound

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

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Thermally Conductive Potting Compound

Degumming Agent

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Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	6.3
Packaging Details:	Plastic/Iron Drums
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

CHINA

Certification:

Product Name:

Epoxy Resin Potting Glue

Color:

Black/Grey/Transparent Color, Can Customized

Application:

PCB/Battery/LED

Package:

5kgs/25kgs/200kgs/bag

Material:

Epoxy Resin&Agent

Keywords:

Waterproof Sealant

Viscosity:

Excellent Viscosity

Certificate:

MSDS RoHS UL

Feature:

Low And High Temperature Resistance

Thermal Conductivity:

Customize

Supply Ability:

1000000KG

Highlight:

Two Component Epoxy Potting Compound

Moistureproof Epoxy Potting Compound

Moistureproof low viscosity potting compound

Product Description

Two-component Epoxy Potting Sealant Moisture-proof Fire Retardant High Temp Conductive Glue for Transformers Resistors Filters Electronic Appliances

HN-5508 Industrial Epoxy Resin Potting Glue

Product Specification

Before curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
	Surface	A sticky epoxy resin water	r liquid specific
	specific gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	storage Period (25℃)	Six months	x months
processabilility	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	Tensile strength of kg/cm	16-18
	Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14
		1.2*10
	Volume resistance ofΩ-cm	15
		1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%
The hardness of SHORE A	85-95
Distortion temperature ℃	130-150
low temperature resistant ℃	-30

Product Describtion
HN-5508 is a two-component epoxy potting compound designed for room-temperature or low-temperature curing. With low viscosity, extended work time, and excellent fluidity, it penetrates easily into product gaps. After curing, it forms a bubble-free, smooth, and glossy surface with high hardness. The cured material exhibits outstanding resistance to acids, alkalis, moisture, and aging, along with superior electrical insulation, voltage resistance, and bonding strength. Ideal for electronic components requiring encapsulation, insulation, and environmental protection.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity 0

Product Advantage
✅ Reliable Protection: Shields against moisture, vibration, and thermal stress.
✅ Versatile: Adapts to diverse electronic and industrial applications.
✅ Cost-Effective: Long pot life reduces waste during processing.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity 1

Technical parameters
Viscosity (Component A: 4500-6000 cps, Component B: 150-250 cps)

Hardness (SHORE D): 85-95

Tensile strength: 16-18 kg/cm²

Compressive strength: 18-22 kg/cm²

Application scenarios
High-voltage packaging: used for insulation and protection of high-voltage equipment.

Aquarium equipment: Provide waterproof and moisture-proof sealing.

Ultrasonic atomizer: Enhance the durability and reliability of equipment.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity 2

Usage method
Mix according to the weight ratio of A:B = 5:1 and use.

Fully cure in 12-16 hours at 25℃, or 1.5-2 hours at 60-80℃.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity 3

Packing specifications
30 KG/group (Component A 25 KG/barrel, Component B 5 KG/can)

Contact Us for samples or customized solutions!

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Products Details

Home > Products >

Epoxy Potting Compound

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

All Category

Tin Cure Silicone Rubber

Platinum Cure Silicone Rubber

Clear Liquid Silicone

Food Safe Liquid Silicone

Electronic Silicone Gel

Squishy Silicone Gel

Silicone Potting Compound

Epoxy Potting Compound

Polyurethane Potting Compound

Thermally Conductive Potting Compound

Silicone Pigment

Degumming Agent

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	6.3
Packaging Details:	Plastic/Iron Drums
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

CHINA

Brand Name:

Hanast

Certification:

MSDS

Model Number:

HN-5508AB

Product Name:

Epoxy Resin Potting Glue

Color:

Black/Grey/Transparent Color, Can Customized

Application:

PCB/Battery/LED

Package:

5kgs/25kgs/200kgs/bag

Material:

Epoxy Resin&Agent

Keywords:

Waterproof Sealant

Viscosity:

Excellent Viscosity

Certificate:

MSDS RoHS UL

Feature:

Low And High Temperature Resistance

Thermal Conductivity:

Customize

Minimum Order Quantity:

1KG

Price:

6.3

Packaging Details:

Plastic/Iron Drums

Delivery Time:

3-5 work days

Payment Terms:

T/T

Supply Ability:

1000000KG

Highlight:

Two Component Epoxy Potting Compound

Moistureproof Epoxy Potting Compound

Moistureproof low viscosity potting compound

Product Description

Two-component Epoxy Potting Sealant Moisture-proof Fire Retardant High Temp Conductive Glue for Transformers Resistors Filters Electronic Appliances

HN-5508 Industrial Epoxy Resin Potting Glue

Product Specification

Before curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
	Surface	A sticky epoxy resin water	r liquid specific
	specific gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	storage Period (25℃)	Six months	x months
processabilility	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	Tensile strength of kg/cm	16-18
	Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14
		1.2*10
	Volume resistance ofΩ-cm	15
		1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%
The hardness of SHORE A	85-95
Distortion temperature ℃	130-150
low temperature resistant ℃	-30

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity 0

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity 1

Technical parameters
Viscosity (Component A: 4500-6000 cps, Component B: 150-250 cps)

Hardness (SHORE D): 85-95

Tensile strength: 16-18 kg/cm²

Compressive strength: 18-22 kg/cm²

Application scenarios
High-voltage packaging: used for insulation and protection of high-voltage equipment.

Aquarium equipment: Provide waterproof and moisture-proof sealing.

Ultrasonic atomizer: Enhance the durability and reliability of equipment.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity 2

Usage method
Mix according to the weight ratio of A:B = 5:1 and use.

Fully cure in 12-16 hours at 25℃, or 1.5-2 hours at 60-80℃.

Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity 3

Packing specifications
30 KG/group (Component A 25 KG/barrel, Component B 5 KG/can)

Contact Us for samples or customized solutions!

Tags: