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HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems

HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems

Product Details:
Place of Origin: Shenzhen in China
Brand Name: Hanast
Certification: FDA
Model Number: HN-8810A/B
Detail Information
Place of Origin:
Shenzhen in China
Brand Name:
Hanast
Certification:
FDA
Model Number:
HN-8810A/B
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silicone potting compound for automotive

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potting compound for vehicle power systems

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automotive electronics potting compound

Trading Information
Minimum Order Quantity:
2 kgs/ for sample
Price:
5$
Packaging Details:
2kg, 10kg, 25kg
Delivery Time:
5-8 work days
Payment Terms:
T/T,Paypal
Supply Ability:
20 tons/day
Product Description

Product Description

  1. HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems

HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems 0

Product Overview

  1. Industry Application Focus
    HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems
    Specifically engineered for automotive applications, this potting compound offers excellent heat resistance, vibration damping, and moisture protection. Ideal for HID ballasts, ignition control modules, and on-board chargers, ensuring long-term reliability in harsh operating environments.


HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems 1

HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems 2

Key Features & Benefits

Excellent Thermal Conductivity – 1.0 W/m·K effectively dissipates heat, prolonging component life.
Wide Operating Temperature Range – Stable performance from -40°C to 150°C.
High Insulation & Flame Retardancy – Volume resistivity ≥5.0×10¹⁴ Ω·cm, UL94 V-0 rated.
Waterproof & Anti-Aging – Protects against moisture, humidity, and long-term degradation.
Easy to Use – 60-120 minutes work time at 25°C, cures fully in 2-4 hours at room temperature.


Typical Applications

Automotive electronics: HID ballasts, ignition control modules

Power supplies & inverters

Network transformers & communication devices

LED drivers & lighting systems

PCB potting and encapsulation


Technical Specifications



Property Value
Mix Ratio (A:B) 1:1 by weight
Viscosity (mixed) 2000-3000 cP
Hardness (Shore A) 40-45
Thermal Conductivity 1.0 ± 0.0.5 W/m·K
Volume Resistivity ≥5.0×10¹⁴ Ω·cm
Flame Retardancy UL94 V-0
Curing Time (25°C) 2-4 hours
Curing Time (80°C) 10-20 minutes


How to Use HN-8810 Potting Compound

  1. Weighing – Accurately weigh components A and B in a 1:1 ratio.

  2. Mixing – Stir thoroughly until uniform color is achieved.

  3. Degassing – Vacuum degas to remove entrapped air bubbles.

  4. Potting – Pour into clean, dry housing; avoid contamination.

  5. Curing – Allow to cure at room temperature or accelerate with mild heat.

Compatibility Notes
Avoid contact with inhibitors such as:

  • Organotin compounds

  • Sulfur or amine-based materials

  • Phosphorous-containing substances

  • Acidic residues or flux

Packaging & Storage

1.50 kg/kit (25 kg A + 25 kg B)

2.Store in a cool, dry place away from direct sunlight

3.Shelf life: 6 months in sealed containers