Product Description
HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems
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Key Features & Benefits
Excellent Thermal Conductivity – 1.0 W/m·K effectively dissipates heat, prolonging component life.
Wide Operating Temperature Range – Stable performance from -40°C to 150°C.
High Insulation & Flame Retardancy – Volume resistivity ≥5.0×10¹⁴ Ω·cm, UL94 V-0 rated.
Waterproof & Anti-Aging – Protects against moisture, humidity, and long-term degradation.
Easy to Use – 60-120 minutes work time at 25°C, cures fully in 2-4 hours at room temperature.
Typical Applications
Automotive electronics: HID ballasts, ignition control modules
Power supplies & inverters
Network transformers & communication devices
LED drivers & lighting systems
PCB potting and encapsulation
Technical Specifications
| Property | Value |
|---|---|
| Mix Ratio (A:B) | 1:1 by weight |
| Viscosity (mixed) | 2000-3000 cP |
| Hardness (Shore A) | 40-45 |
| Thermal Conductivity | 1.0 ± 0.0.5 W/m·K |
| Volume Resistivity | ≥5.0×10¹⁴ Ω·cm |
| Flame Retardancy | UL94 V-0 |
| Curing Time (25°C) | 2-4 hours |
| Curing Time (80°C) | 10-20 minutes |
How to Use HN-8810 Potting Compound
Weighing – Accurately weigh components A and B in a 1:1 ratio.
Mixing – Stir thoroughly until uniform color is achieved.
Degassing – Vacuum degas to remove entrapped air bubbles.
Potting – Pour into clean, dry housing; avoid contamination.
Curing – Allow to cure at room temperature or accelerate with mild heat.
Compatibility Notes
Avoid contact with inhibitors such as:
Organotin compounds
Sulfur or amine-based materials
Phosphorous-containing substances
Acidic residues or flux
Packaging & Storage
1.50 kg/kit (25 kg A + 25 kg B)
2.Store in a cool, dry place away from direct sunlight
3.Shelf life: 6 months in sealed containers