High-Performance 1:1 Silicone Encapsulants For Ultimate Protection For Power Supply Battery Weatherproof Silicone Potting Compound
Product Overview for silicone potting compound:
Two-component silicone potting compounds feature properties such as water and moisture resistance, dust protection, electrical insulation, and shock resistance. With a moderate hardness, they effectively fill gaps between electronic components to enhance overall protective performance. Additionally, they possess thermal conductivity and flame-retardant capabilities, making them suitable for heat dissipation applications involving power modules, LED lighting, and similar systems. Typical applications include facilitating thermal transfer at the contact surfaces of power transistors and the comprehensive potting of microwave devices.
Physical Properties of silicone potting compound:
| der number |
inspecting item(Lrems) |
technical requirement
(Technique Request)
|
| 1 |
Appearance (Extreior) |
White, flowing liquid |
| 2 |
Viscosity (before curing) (Viscosity mPa..S) |
A:2000 B:50 |
| 3 |
Specific gravity (Specific gravity 23℃) |
0．98 |
| 4 |
Available time (In commission time h 25℃) |
1-2h |
| 5 |
Overall Cure Time (Entirely sulfuration time min 25℃) |
8-12h |
| 6 |
Shaw Hardness (Hardness JIS A) |
25A |
| 7 |
Volume resistivity (Volume resistivity Ω cm) |
≥1×1014 |
| 8 |
Breakdown voltage (Strength of breakdown voltage kv / mm) |
18-25 |
| 9 |
Dielectric constant (Dielectric constant 1MHZ) |
2．5-3．0 |
| 10 |
Dielectric loss angle tangent (Dielectric loss 1MHZ) |
≤4×10-3 |
| 11 |
Thermal conductivity (Thermal conductivity w / m.k |
0.1-0.20 |
Key Features for silicone potting compound:
- Dual Performance: Exceptional dielectric strength paired with superior thermal conductivity.
- Wide Thermal Range: Flame-retardant formulation stable from -50°C to 250°C (-58°F to 482°F).
- Safe Encapsulation: Non-corrosive, zero-byproduct cure with negligible shrinkage.
- Weatherproof Seal: Industrial-grade moisture resistance and anti-aging durability.
- Curing Characteristics
The curing of silicone potting compounds is fundamentally based on cross-linking chemical reactions, resulting in the formation of a three-dimensional network structure predominantly composed of Si-O-Si bonds. The curing process is influenced by a variety of factors: temperature can significantly affect the curing rate; humidity is particularly critical for one-component products that rely on moisture for curing; the required curing time must be determined based on the specific type of compound and the prevailing conditions; and the type and quantity of the curing agent directly determine both the curing mechanism and the rate.
Product Applications for silicone potting compound:
The electronics sector is the largest application area, used to protect sensitive components such as microprocessors, memory devices, surface mount packages, beam bonding elements, and automotive electronics from the adverse effects of chemical exposure, thermal stress, and moisture. From a terminal industry perspective, consumer electronics is the largest sector, widely used in compact, durable, and lightweight devices such as smartphones, home appliances, and wearable devices. In addition to consumer electronics, silicone potting compounds are also widely used in automotive (especially electric vehicles), aerospace (for shock absorption and corrosion resistance), industrial automation, renewable energy (such as solar panels, inverters, and wind turbines in solar and wind energy projects), LED lighting, and medical electronics
How to use silicone potting compound:
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