10:1 Transparent Silicone Potting Compound For Led Strip Lights Two-Component, Transparent Liquid Silicone Rubber
Product description of silicone potting compound:
10:1 transparent silicone potting compound refers to a two-component, transparent liquid silicone rubber that cures at room temperature via condensation or addition cross-linking reactions, and is mixed and used at a weight ratio of 10:1.
![]()
Technical Parameters of 10:1 Silicone Encapsulant
| № | Itrems | Technique Request |
| 1 | Appearance |
Transparent, White, Black Flowing Liquid |
| 2 | Viscosity (before curing) (mPa.S) | A:2000 B:50 |
| 3 | Specific Gravity (23℃) | 0.98 |
| 4 | Available Time (h, 25℃) | 1-2h |
| 5 | Entirely Cure Time (h, 25℃) | 8-12h |
| 6 | Shaw Hardness (JIS A) | 25A |
| 7 | Volume Resistivity (Ω cm) | ≥1×1014 |
| 8 | Strength of Breakdown Voltage (kv / mm) | 18-25 |
| 9 | Dielectric Constant (1MHZ) | 2.5 - 3.0 |
| 10 | Dielectric Loss Angle Tangent (1MHZ) | ≤4×10-3 |
| 11 | Thermal Conductivity (w / m.k) | 0.1 - 0.20 |
![]()
Main features of Silicone Potting Compound:
1,wide temperature range of - 57°C to 250°C
2,Non-toxic, odorless, non-corrosive, non-swelling.
3,It has adhesive force, has adhesion to metal aluminum, iron, acrylic, and PC plastic, and can improve waterproof sealing performance
4,low viscosity potting compound that cures at room temperature to soft rubber
![]()
Application Areas for Silicone Potting Compound:
The core applications of 10:1 transparent silicone potting compounds can be summarized as "electronic potting scenarios requiring both transparent protection and reparability": the optoelectronics and lighting industries; electronic, electrical, and module packaging; communications and security equipment; and new energy and automotive electronics.
![]()
![]()
How to use 10:1silicone potting compound?
According to the dosage, pour it into the mold after mixing according to A: B=10:1.
Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).