High Temperature Resistant Repairable Silicone Potting Compound For Street Light Driver Modules

Product Overview for silicone potting compound:

Your reliable solution for thermal management. Engineered for superior heat dissipation, HN-8806 features thermal conductivity ≥0.76 W/m·K. It lowers the operating temperature of power devices to boost stability and service life. With excellent electrical insulation, it is perfectly suited for thermal cooling of power electronics.

Key Features for silicone potting compound:

Thermal conductivity ≥0.76 W/m·K for efficient heat dissipation

Superior electrical insulation performance

Outstanding long-term thermal stability

Low coefficient of thermal expansion (CTE)

Non-bleeding formula

Product Applications for silicone potting compound:

Power Modules: Direct potting for IGBTs, MOSFETs, diodes and other power components

LED Drivers: Thermal management & protection for high-power outdoor LED drivers

New Energy Equipment: Power sections of photovoltaic inverters and PCS for energy storage systems

Industrial Drives: Heat dissipation and insulation for inverter and servo drive power units

Usage Instructions for silicone potting compound:

Preparation: Clean heat-generating components and heat sinks to guarantee optimal thermal conduction.

Mixing & Degassing: Stir the mixture completely and perform vacuum deaeration, as air bubbles impair heat transfer.

Potting: Make sure the material fully covers heat sources and closely adheres to cooling surfaces.

Curing: Cure at room temperature or under heating per requirements.

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.