1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for PCB LED Driver Power Module Encapsulation

1.0 W/mK Thermal Conductivity Flame Retardant Silicone Potting Compound for Electronic Component Encapsulation

The HN-8810A/B 1.0 W/mK Thermal Conductivity Silicone Potting Compound is a two-component addition-cure silicone system engineered for PCB power modules, LED drivers, and electronic component encapsulation. With UL 94 V-0 flame retardancy certification and 1.0 W/m·K thermal conductivity, this compound provides balanced heat dissipation, superior electrical insulation and robust environmental protection for medium-power electronic devices.

Key Features

• 1.0 W/m·K Thermal Conductivity: Efficient heat dissipation for medium-power electronic components including transformers, MOSFETs and power modules, maintaining optimal operating temperatures.
• UL 94 V-0 Flame Retardancy: Certified flame retardant performance ensuring fire safety compliance for electronic products in automotive, industrial and consumer applications.
• 1:1 Mixing Ratio: Simple two-part mixing with minimal measurement error, compatible with both manual pouring and automated dispensing equipment for production efficiency.
• Superior Electrical Insulation: Volume resistivity ≥5.0*10^14 Ω·cm providing excellent dielectric protection, mitigating risk of short circuits and electrical leakage.
• Wide Temperature Range -40°C to +150°C: Stable elastomer performance across extreme operating environments, from cold start conditions to sustained high-temperature operation.
• Excellent Vibration and Moisture Resistance: Protects sensitive electronic assemblies from mechanical shock, dust ingress and humidity in harsh industrial environments.

Applications

• Power Module Encapsulation: Protects DC/DC converters, AC/DC power supplies and voltage regulators through complete potting encapsulation, ensuring long-term reliability under thermal cycling.
• Photovoltaic Inverter Potting: Provides critical environmental sealing for solar inverter electronics, protecting against outdoor exposure, temperature swings and condensation.
• On-Board Charger (OBC) Protection: Encapsulates EV on-board charger electronics with vibration-resistant and thermally conductive protection for automotive-grade durability.
• LED Driver Power Supply Potting: Enhances thermal management of LED driver circuits, extending luminaire service life and maintaining consistent light output.
• Motor Stator Coil Potting: Protects motor windings and stator assemblies from moisture, dust and vibration in industrial motor and automotive applications.
• Industrial Controller Sealing: Provides dust-proof, moisture-resistant encapsulation for PLC modules, sensors and industrial IoT devices operating in factory environments.

Technical Specifications

Packaging and Storage

• Standard packaging: 50Kg/set (Component A 25Kg + Component B 25Kg)
• Custom packaging configurations available for volume orders
• Store in a cool, dry environment away from direct sunlight and moisture
• Shelf life: 6 months in original sealed packaging

For bulk pricing on 1.0 W/mK thermally conductive flame retardant silicone potting compound, or to request technical datasheets and samples, please contact our engineering sales team. Custom thermal conductivity formulations and viscosity adjustments available upon request.