HN-8806 is a flexible two-component 1:1 addition cure silicone electronic potting gel specifically developed for solar inverter PCB protection and BESS (Battery Energy Storage System) power module encapsulation. With its low-viscosity deep-section curing capability, IP67-equivalent waterproof sealing, and 0.76 W/m·K thermal conductivity, it provides comprehensive environmental protection for renewable energy power electronics. The flexible Shore A 50±5 elastomer after curing absorbs thermal expansion stress, preventing PCB component damage in outdoor solar installations. RoHS compliant, UL 94 V-0 flame retardant, and available in factory-direct bulk supply.
| Parameter | Part A | Part B |
|---|---|---|
| Appearance (Before Curing) | Grey Fluid | White Fluid |
| Viscosity at 25°C | 4500~5000 mPa·s | 4500~5000 mPa·s |
| Density at 25°C | 1.50±0.05 g/cm³ | 1.50±0.05 g/cm³ |
| Mixing Ratio (A:B) | 1:1 (Weight & Volume) | |
| Operating Time | 0.3-0.4 hr at 25°C | |
| Curing Condition | 4-12 hr at 25°C / 0.2 hr at 80°C | |
| Property (After Curing) | Value | Test Standard |
|---|---|---|
| Appearance | Grey Flexible Elastomer | Visual |
| Hardness | Shore A 50±5 | GB/T 531.1-2008 |
| Thermal Conductivity | ≥0.76 W/m·K | GB/T 10297-1998 |
| Volume Resistivity | ≥1.0*10¹⁶ Ω·cm | GB/T 1692-92 |
| Dielectric Strength | 18-25 kV/mm | GB/T 1693-2007 |
| Moisture Absorption (24h, 25°C) | 0.01-0.02% | GB/T 8810-2005 |
| Expansivity | 210 µm/(m·°C) | GB/T 20673-2006 |
| Temperature Resistance | -50 to +250°C | Measured |
| Flame Retardancy | UL 94 V-0 (3mm sample) | UL 94 |
Encapsulates MPPT controllers, DC-AC inverter boards, and power semiconductors in outdoor string and central inverters. IP67 waterproofing ensures 25-year service life matching solar panel warranties.
Protects battery management modules, DC-DC converters, and power distribution units in residential, commercial, and utility-scale energy storage systems.
Suitable for IGBT power modules, charging pile controllers, UPS systems, and industrial automation power supplies requiring flexible stress-absorbing encapsulation.
Flexible · Stress absorbing · Repairable · Deep section cure · Wide temp range
Rigid · Stress prone · Non-repairable · Exotherm risk · Narrow temp range
Silicone gel's flexibility absorbs thermal cycling stress in outdoor solar applications, while its repairability allows PCB rework — a critical advantage epoxy cannot offer. The deep-section cure capability enables single-pour encapsulation of tall BESS power modules without layered potting.
Standard kit packaging: 10kg/Set (A:5kg + B:5kg), 20kg/Set (A:10kg + B:10kg), 50kg/Set (A:25kg + B:25kg). Export-grade moisture-proof packaging. Minimum order: 10kg. Factory-direct wholesale from 40,000 sqm production base with 50,000 kg monthly capacity. Store in cool dry place at room temperature. Shelf life: 6 months. Non-toxic, non-dangerous goods. MSDS and TDS provided with every shipment. Contact us for volume pricing, custom formulations, and free sample evaluation.
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