1:1 Mix Ratio UL 94 V-0 Flame Retardant Silicone Potting Compound with Thermal Conductivity ≥ 0.76 W/m.K

HANAST HN-8806A/B 1:1 Flexible Flame Retardant Silicone Potting Compound for Electronic Components Protection

HN-8806A/B is a two-component silicone potting compound that cures at room temperature or by heating into a high-performance flexible elastomer. Mixed at an 1:1 equal-part A/B component ratio by weight, it combines flame retardant (UL 94 V-0) encapsulation with thermal conductivity, electrical insulation and wide-temperature aging resistance, making it an ideal flexible potting resin for protecting and potting electronic components, power modules and circuit boards.

Key Features

• Two component 1:1 equal-part system — simple A/B component mixing by weight for consistent results.
• Flame retardant / fire resistant encapsulation — UL 94 V-0 flame retardancy; self-extinguishing, non-flammable and halogen-free, a true flame retardant compound for electronics.
• Thermal conductive potting — thermal conductivity ≥ 0.76 W/m·K for effective heat dissipation and thermal management of heat-generating components (thermal conductive potting / thermally conductive encapsulant).
• High electrical insulation — excellent insulation resistance and voltage resistance, with volume resistivity 1.0 × 10¹⁶ Ω·cm and dielectric strength 25–30 kV/mm (insulation compound / electrical insulating potting).
• Wide operating temperature range −50 °C to 250 °C — heat resistant silicone encapsulant with good thermal stability and wide-temperature performance.
• Flexible, stress-relieving elastomer — Shore A 45±5; cushions components against mechanical protection, impact resistance, vibration dampening and drop protection while remaining soft and flexible.
• Water resistant and moisture proof — waterproofing compound with humidity protection, damp proof sealing and moisture resistance for harsh, humid environments.
• UV and weather resistant — UV stable, anti-yellowing outdoor encapsulation for long-term reliability.
• Extremely low cure shrinkage — no heat or by-products released during cure, no corrosion to sealed components and deep-section curing.
• RoHS compliant, non-hazardous general chemical and environmentally friendly.

Technical Specifications (HN-8806A/B)

Mixing & Application Instructions

1. Pre-mix: Stir Components A and B thoroughly before use as fillers may settle during storage. Seal containers tightly after use.
2. Weighing: Accurately weigh Components A and B at a 1:1 ratio by weight using a precision electronic scale.
3. Mixing: Mix A and B thoroughly in the same direction to avoid introducing excessive bubbles; scrape the container walls and bottom for full dispersion. Uneven mixing may cause local incomplete cure.
4. Degassing (optional): For void-sensitive applications, vacuum degas to remove air introduced during mixing for void-free potting and deep fill of fine gaps and windings.
5. Pouring / Potting: Pour the mixed compound into the clean, dry device within the open time / working time (pot life 18–24 min at 25 °C), ensuring complete coverage; suitable for manual potting and automatic dispensing machines.
6. Curing: Cure at room temperature (25 °C, 2–3 h preliminary) or heat accelerated (80 °C, only 12 min) when a short curing time / rapid curing is required. Do not move or stress the part during cure.

Typical Applications

Flexible flame retardant potting and encapsulation of electronic components, power modules and circuit boards, including:

• Electronic components, PCBs, circuit boards, sensors, controllers and general electronic appliances
• Power modules, power supplies, transformers, inductors, IGBT and semiconductor devices
• LED modules, LED drivers, LED power supply, LED lighting, lighting potting and outdoor LED encapsulation
• EV battery, EV potting, battery pack, BMS potting, battery management systems, on-board charger (OBC) and inverter potting for electric vehicles
• Automotive electronics, automotive ECU, motor controllers and ignition coils
• 5G base station, 5G potting, RF module, antenna potting, telecom and communication equipment
• Photovoltaic, PV junction box, junction box potting, solar module, solar inverter and renewable energy
• Industrial controllers, connectors, relays, junction boxes, underwater and aquarium equipment

Packaging, Storage & Supply

• Packaging: Component A 25 kg plastic barrel + Component B 25 kg plastic barrel, 50 kg/set kit.
• Storage: Store in original, tightly sealed containers in a cool, dry, well-ventilated area at 25 °C; protect from direct sunlight, moisture and extreme temperatures.
• Shelf life: 6 months from date of manufacture when stored as recommended.
• Supply: Direct China manufacturer (Shenzhen, Guangdong) offering OEM/ODM customization of hardness, viscosity, pot life, cure speed and colour, with free samples and bulk wholesale supply at factory-direct pricing.

About This Supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-8806A/B and which applications does it suit?

HN-8806A/B is a 1:1 two-component flexible flame retardant silicone potting compound (Shore A 45±5) with thermal conductivity and high electrical insulation. It suits potting and protection of electronic components, power modules, circuit boards, LED drivers, sensors, transformers, EV/automotive electronics, 5G and photovoltaic modules.

Q2: What are the mix ratio and curing schedule?

Mix Component A and Component B at a 1:1 ratio by weight. Pot life / operating time is 18–24 min at 25 °C; it cures at room temperature in 2–3 h (preliminary), or in only 12 min at 80 °C for fast / heat-accelerated cure.

Q3: What are the thermal and electrical insulation performance?

It offers thermal conductivity ≥ 0.76 W/m·K for heat dissipation and thermal management, with volume resistivity 1.0 × 10¹⁶ Ω·cm, dielectric strength 25–30 kV/mm and UL 94 V-0 flame retardancy for reliable insulation and fire safety.

Q4: What is the operating temperature range and environment resistance?

It operates from −50 °C to 250 °C, is water resistant and moisture proof with humidity protection, and is UV and weather resistant for harsh, humid and outdoor environments.

Q5: What are the MOQ, packaging and delivery time?

Minimum order quantity is 1 kg, supplied as 25 kg (A) + 25 kg (B) 50 kg/set kits. Free samples ship in 3–5 working days and bulk orders in 7–15 days, with bulk silicone encapsulant supply available across Asia and worldwide.