Two-Component Thermal Conductive Flame Retardant UL 94 V-0 Silicone Potting Compound with 1:1 Mix Ratio for Power LED Modules

Two Component Thermal Conductive Flame Retardant Silicone Potting Compound for Power LED Module Encapsulation

HN-8806A/B is a two-component thermal conductive flame retardant silicone potting compound that cures at room temperature or by heating into a high-performance flexible elastomer. Mixed at a 1:1 equal-part A/B component ratio by weight, HN-8806A/B delivers thermal conductive potting (≥0.76 W/m·K) for heat dissipation and thermal management, together with UL 94 V-0 flame retardant fire resistance, high electrical insulation and a wide −50 °C to 250 °C operating range. Its low-viscosity liquid flows easily into fine fill and deep fill gaps, is water resistant and moisture proof with humidity protection, UV stable and anti-yellowing, and cushions components with flexible shockproof impact and vibration resistance. This makes it an ideal electronic potting silicone for power LED modules, LED drivers, power supplies, EV battery and BMS potting, 5G RF modules, photovoltaic junction boxes and other demanding electronic encapsulation and circuit board protection.

Key Features

• Two Component 1:1 Equal-Part System — Simple AB component mixing at a 1:1 ratio by weight for consistent, repeatable results and easy processing, suitable for manual and automatic dispensing.
• Thermal Conductive Potting — Thermal conductivity ≥ 0.76 W/m·K acts as an effective thermal interface for heat transfer, heat dissipation and thermal management of power LED modules, power supplies and semiconductors.
• Flame Retardant & Fire Resistant — UL 94 V-0 flame retardancy with self-extinguishing, non-flammable, halogen-free fire retardant silicone performance for safety-critical flame retardant compound applications.
• High Electrical Insulation — Excellent insulation resistance, voltage resistance and electrical insulating performance with volume resistivity 1.0 × 10¹⁶ Ω·cm and dielectric strength 25–30 kV/mm.
• Wide Temperature Range −50 °C to 250 °C — Heat resistant silicone encapsulant with good thermal stability and long-term aging resistance across a wide temperature range.
• Low Viscosity Liquid, Fine & Deep Fill — 2000–3000 mPa·s low viscosity, self-leveling liquid penetrates fine fill gaps and supports deep fill and deep-section curing with extremely low shrinkage.
• Water Resistant & Moisture Proof — Waterproofing compound with humidity protection, damp proof sealing and moisture resistance (IP67/IP68 grade protection concept) for harsh, humid environments.
• Shockproof & Vibration Resistant — Flexible Shore A 45±5 elastomer cushions components against impact resistance, mechanical protection, vibration dampening and drop protection.
• Fast / Room Temperature Curing — Quick cure and rapid curing: preliminary room temperature cure in 2–3 h, or a short curing time of only 12 min at 80 °C for heat-accelerated fast curing potting.
• UV Stable & Anti-Yellowing — UV stable, anti-UV and anti-yellowing outdoor UV performance for long-term weather resistance and reliable outdoor encapsulation.
• Good Adhesion to Substrates — Adhesive strength and strong substrate adhesion to PCB, metal and plastic housings without primer, with no corrosion to sealed components.
• RoHS Compliant & Environmentally Friendly — No heat or by-products released during cure and non-hazardous general chemical; compliant with RoHS and related environmental requirements.

Technical Specifications (HN-8806A/B)

Mixing & Application Instructions

1. Pre-mix: Stir Components A and B thoroughly before use as fillers may settle during storage; seal containers tightly after use.
2. Weighing: Accurately weigh Components A and B at a 1:1 ratio by weight using a precision electronic scale.
3. Mixing: Mix A and B thoroughly in the same direction to avoid introducing excessive bubbles; scrape the container walls and bottom for full dispersion. Uneven mixing may cause local incomplete cure.
4. Degassing (optional): For void-sensitive applications, vacuum degas to remove air introduced during mixing for void-free potting and deep fill of fine gaps and windings.
5. Pouring / Potting: Pour the mixed compound into the clean, dry device within the open time / working time (pot life 18–24 min at 25 °C), ensuring complete coverage; suitable for manual potting and automatic dispensing machines.
6. Curing: Cure at room temperature (25 °C, 2–3 h preliminary) or heat accelerated (80 °C, only 12 min) when a short curing time / rapid curing is required. Do not move or stress the part during cure.

Typical Applications

Two-component thermal conductive flame retardant potting and encapsulation of electronic components, power modules and circuit boards, including:

• Power LED modules, LED drivers, LED power supply, LED lighting, lighting potting, LED encapsulant and outdoor LED encapsulation
• Power supplies and power modules, transformers, inductors, IGBT and semiconductor devices requiring heat dissipation
• Electronic components, PCBs, circuit boards, sensors, controllers and general electronic appliances
• EV battery, EV potting, battery pack, BMS potting, battery management systems, on-board charger (OBC) and inverter potting for electric vehicles
• Automotive electronics, automotive ECU, motor controllers and ignition coils
• 5G base station, 5G potting, RF module, antenna potting, telecom and communication equipment
• Photovoltaic, PV junction box, junction box potting, PV potting, solar module, solar inverter and renewable energy
• Industrial controllers, connectors, relays, junction boxes, underwater and aquarium equipment

Packaging, Storage & Supply

• Packaging: Component A 25 kg plastic barrel + Component B 25 kg plastic barrel, 50 kg/set kit.
• Storage: Store in original, tightly sealed containers in a cool, dry, well-ventilated area at 25 °C; protect from direct sunlight, moisture and extreme temperatures.
• Shelf life: 6 months from date of manufacture when stored as recommended.
• Supply: Direct China manufacturer (Shenzhen, Guangdong) offering OEM/ODM customization of hardness, viscosity, pot life, cure speed and colour, with free samples and bulk wholesale supply at factory-direct pricing.

About This Supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-8806A/B and which applications does it suit?

A: HN-8806A/B is a two-component 1:1 thermal conductive flame retardant silicone potting compound (Shore A 45±5). It suits potting and protection of power LED modules, LED drivers, power supplies, circuit boards, sensors, transformers, EV/automotive electronics, 5G and photovoltaic modules.

Q2: What are the mix ratio and curing schedule?

A: Mix Component A and Component B at a 1:1 ratio by weight. Pot life / operating time is 18–24 min at 25 °C; it cures at room temperature in 2–3 h (preliminary), or in only 12 min at 80 °C for fast, heat-accelerated curing.

Q3: What are the thermal and electrical insulation performance?

A: It offers thermal conductivity ≥ 0.76 W/m·K for heat dissipation and thermal management, with volume resistivity 1.0 × 10¹⁶ Ω·cm, dielectric strength 25–30 kV/mm and UL 94 V-0 flame retardancy for reliable insulation and fire safety.

Q4: What is the operating temperature range and environment resistance?

A: It operates from −50 °C to 250 °C, is water resistant and moisture proof with humidity protection, and is UV stable and anti-yellowing for harsh, humid and outdoor environments.

Q5: What are the MOQ, packaging and delivery time?

A: Minimum order quantity is 1 kg, supplied as 25 kg (A) + 25 kg (B) 50 kg/set kits. Free samples ship in 3–5 working days and bulk orders in 7–15 days, with bulk silicone encapsulant supply available across Asia and worldwide.