UL 94 V-0 Flame Retardant Thermal Conductive Silicone Potting Compound with Fast Cure 12 min at 80 °C for Power Modules

Flame Retardant Thermal Conductive Silicone Potting Compound UL 94 V-0 Fast Cure for IGBT Power Module

HN-8806A/B is a flame retardant thermal conductive silicone potting compound with UL 94 V-0 fire resistance, designed for potting and protection of IGBT and power modules. Mixed at a 1:1 equal-part A/B component ratio by weight, it cures at room temperature or by heating into a high-performance flexible elastomer with thermal conductivity ≥0.76 W/m·K for heat dissipation, heat transfer and thermal management. It offers high electrical insulation with volume resistivity 1.0 × 10¹⁶ Ω·cm and dielectric strength 25–30 kV/mm, a wide −50 °C to 250 °C operating range, and a fast cure of only 12 min at 80 °C. The low-viscosity liquid fills fine and deep sections, is water resistant and moisture proof, UV stable and anti-yellowing, and cushions components against impact and vibration — a reliable flame retardant compound for power electronics, power supplies, transformers and LED drivers.

Key Features

• UL 94 V-0 Flame Retardant — Flame retardant compound with self-extinguishing, non-flammable and fire retardant silicone performance (fire resistant / V-0 rating) for safety-critical power electronics.
• Thermal Conductive Potting — Thermal conductivity ≥0.76 W/m·K as an effective thermal interface for heat transfer, heat dissipation and thermal management of IGBT and power modules.
• Fast Cure (12 min at 80 °C) — Quick cure, rapid curing and a short curing time with heat acceleration; preliminary 2–3 h at room temperature for fast curing potting.
• High Electrical Insulation — Excellent insulation resistance, voltage resistance and electrical insulating performance with volume resistivity 1.0 × 10¹⁶ Ω·cm and dielectric strength 25–30 kV/mm.
• Two Component 1:1 Equal-Part — Simple AB component mixing at a 1:1 ratio by weight for consistent results and easy dispensing.
• Wide Temperature Range −50 °C to 250 °C — Heat resistant silicone encapsulant with good thermal stability and long-term aging resistance.
• Low Viscosity, Fine & Deep Fill — 2000–3000 mPa·s self-leveling liquid penetrates fine fill gaps and supports deep fill and deep-section curing with extremely low shrinkage.
• Water Resistant & Moisture Proof — Waterproofing compound with humidity protection and moisture resistance for harsh, humid environments.
• Shockproof & Vibration Resistant — Flexible Shore A 45±5 elastomer cushions components against impact resistance, mechanical protection, vibration dampening and drop protection.
• UV Stable & Anti-Yellowing — UV stable, anti-UV and anti-yellowing weather resistance for long-term outdoor reliability.
• Good Substrate Adhesion — Adhesive strength and strong substrate adhesion to PCB, metal and plastic housings without primer, with no corrosion to sealed components.
• RoHS Compliant — No heat or by-products released during cure; non-hazardous general chemical and environmentally friendly.

Technical Specifications (HN-8806A/B)

Mixing & Application Instructions

1. Pre-mix: Stir Components A and B thoroughly before use as fillers may settle during storage; seal containers tightly after use.
2. Weighing: Accurately weigh Components A and B at a 1:1 ratio by weight using a precision electronic scale.
3. Mixing: Mix A and B thoroughly in the same direction to avoid introducing excessive bubbles; scrape container walls and bottom for full dispersion.
4. Degassing (optional): For void-sensitive applications, vacuum degas to remove air for void-free and deep fill potting.
5. Pouring / Potting: Pour the mixed compound into the clean, dry device within the working time (pot life 18–24 min at 25 °C), ensuring complete coverage.
6. Curing: Cure at room temperature (25 °C, 2–3 h preliminary) or heat accelerated (80 °C, only 12 min) when a short curing time / rapid curing is required.

Typical Applications

Flame retardant thermal conductive potting and encapsulation of power electronics, including:

• IGBT power modules, power supplies, transformers, inductors and semiconductor devices requiring heat dissipation and insulation
• LED drivers, LED power supply, LED modules, lighting potting and LED encapsulant
• EV battery, EV potting, battery pack, BMS potting, on-board charger (OBC) and inverter potting
• Photovoltaic, PV junction box, junction box potting, solar module and solar inverter
• 5G base station, 5G potting, RF module, antenna potting and communication equipment
• Automotive electronics, automotive ECU, motor controllers and ignition coils
• Electronic components, PCBs, circuit boards, sensors, controllers, connectors, relays and junction boxes

Packaging, Storage & Supply

• Packaging: Component A 25 kg plastic barrel + Component B 25 kg plastic barrel, 50 kg/set kit.
• Storage: Store in original, tightly sealed containers in a cool, dry, well-ventilated area at 25 °C; protect from direct sunlight, moisture and extreme temperatures.
• Shelf life: 6 months from date of manufacture when stored as recommended.
• Supply: Direct China manufacturer (Shenzhen, Guangdong) offering OEM/ODM customization of hardness, viscosity, pot life, cure speed and colour, with free samples and bulk wholesale supply at factory-direct pricing.

About This Supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: Does HN-8806A/B have UL 94 V-0 flame retardancy and thermal conductivity?

A: Yes. HN-8806A/B is a flame retardant thermal conductive silicone potting compound with UL 94 V-0 flame retardancy (self-extinguishing, non-flammable) and thermal conductivity ≥ 0.76 W/m·K for heat dissipation and thermal management.

Q2: What is the mix ratio and curing schedule?

A: Mix Component A and Component B at a 1:1 ratio by weight. Pot life is 18–24 min at 25 °C; it cures in 2–3 h at room temperature (preliminary), or only 12 min at 80 °C for fast, heat-accelerated curing.

Q3: What are the electrical insulation performance and hardness?

A: It offers volume resistivity 1.0 × 10¹⁶ Ω·cm, dielectric strength 25–30 kV/mm and a flexible Shore A 45±5 cured elastomer with extremely low cure shrinkage.

Q4: What is the operating temperature range and environmental resistance?

A: It operates from −50 °C to 250 °C, is water resistant and moisture proof with humidity protection, and is UV stable and anti-yellowing for harsh and outdoor environments.

Q5: What are the MOQ, packaging and delivery time?

A: Minimum order quantity is 1 kg, supplied as 25 kg (A) + 25 kg (B) 50 kg/set kits. Free samples ship in 3–5 working days and bulk orders in 7–15 days; OEM/ODM customization is available.