2.0 W/mK Thermally Conductive UL 94 V-0 Flame Retardant Silicone Potting Compound with 1:1 Mix Ratio for Automotive Power Modules

HN-8820 2.0 W/mK Thermally Conductive V-0 Flame Retardant Silicone Potting Compound for Automotive Power Module

HN-8820A/B is a two-component addition-cure (platinum-catalysed) thermally conductive silicone potting compound with a 1:1 equal-part A/B component mix ratio by weight. It delivers a high thermal conductivity of 2.0 ± 0.1 W/m·K for effective heat dissipation, heat transfer and thermal management, together with UL 94 V-0 flame retardancy and excellent electrical insulation. With low viscosity (5000–8000 mPa·s) and good fluidity, it pours and self-levels easily and degasses well; it cures at room temperature or by heat acceleration (80 °C, 10–20 min) into a flexible grey elastomer. The cured compound maintains rubber elasticity over a wide −40 °C to 150 °C range and offers reliable waterproof, moisture-proof and anti-ageing performance — an ideal flame retardant potting compound for power modules, automotive HID lamp module power supplies, ignition system module power supplies and network transformers.

Key Features

• 2.0 W/m·K High Thermal Conductivity — Thermal conductive potting at 2.0 ± 0.1 W/m·K acts as an effective thermal interface for heat dissipation, heat transfer and thermal management of power modules.
• UL 94 V-0 Flame Retardant — Flame retardant compound with self-extinguishing, non-flammable and fire retardant silicone performance (fire resistant / V-0 rating) for safety-critical power electronics.
• 1:1 Two Component Addition Cure — Simple AB component mixing at a 1:1 ratio by weight with platinum-catalysed addition cure for consistent, low-shrinkage results.
• Low Viscosity & High Fluidity — 5000–8000 mPa·s low-viscosity liquid pours and self-levels easily and degasses well for fine fill and deep fill potting.
• Excellent Electrical Insulation — Electrical insulating performance with volume resistivity ≥ 5.0 × 10¹⁴ Ω·cm and good voltage resistance for reliable insulation.
• Wide Temperature Range −40 °C to 150 °C — Heat resistant silicone encapsulant maintains rubber elasticity and thermal stability over a wide temperature range.
• Waterproof, Moisture-proof & Anti-ageing — Water resistant and moisture proof with humidity protection and damp proof sealing (waterproofing compound) for harsh, humid environments.
• Fast / Room Temperature Curing — Quick cure and rapid curing with a short curing time of only 10–20 min at 80 °C, or ambient-temperature cure per pot life.
• Flexible & Stress-Relieving — Soft Shore A 45–50 elastomer cushions components against impact resistance, mechanical protection, vibration dampening and drop protection.
• Anti-ageing & Anti-yellowing — Good anti-ageing, UV stable and anti-yellowing performance for long-term reliability.
• Good Adhesion & No Corrosion — Good adhesion to substrates with no corrosion to sealed components during cure.
• RoHS Compliant — Non-dangerous general chemical; environmentally friendly and RoHS compliant.

Technical Specifications (HN-8820A/B)

Mixing & Application Instructions

1. Pre-mix: Stir Component A thoroughly before use as fillers may settle during storage; shake or stir Component B well to ensure homogeneity.
2. Weighing: Accurately weigh Components A and B per the 1:1 mix ratio by weight (not by volume) using a precision electronic scale.
3. Mixing: Mix A and B thoroughly until uniform in colour; scrape container walls and bottom for full dispersion and avoid excess air.
4. Degassing (optional): For void-sensitive applications, degas under vacuum to remove air introduced during mixing for void-free and deep fill potting.
5. Pouring / Potting: Pour the mixed compound into the clean, dry device within pot life; ensure complete coverage and no trapped air.
6. Curing: Cure by heat acceleration (80 °C, 10–20 min) or at room temperature per pot life; do not move or stress the part during cure.

Cure Inhibition Precautions

As an addition-cure silicone, HN-8820A/B may fail to cure in contact with organotin/tin silicones, sulfur and polysulfide compounds, amines/polyurethane/ammonia, phosphorus compounds, acidic substances and solder flux residues. Ensure all substrates and tools are clean and free of these contaminants, and avoid contact with condensation-cure (acetoxy) silicones, epoxy resin and polyurethane.

Typical Applications

2.0 W/m·K thermally conductive flame retardant potting and encapsulation of electronics, including:

• Power modules, including automotive HID lamp module power supplies and automotive ignition system module power supplies
• Network transformers and other electronic appliances, transformers and inductors
• General electronic components, PCBs and circuit boards requiring heat dissipation
• LED drivers, LED power supply and lighting potting
• EV battery, BMS potting, on-board charger (OBC) and inverter potting
• Photovoltaic, PV junction box and solar inverter
• 5G base station, RF module, antenna potting and communication equipment
• Automotive electronics, automotive ECU, motor controllers and sensors

Packaging, Storage & Supply

• Packaging: Component A 25 kg plastic barrel + Component B 25 kg plastic barrel, 50 kg/set kit.
• Storage: Store in original, tightly sealed containers in a cool, dry, well-ventilated area (5–25 °C); protect from direct sunlight, moisture and extreme temperatures.
• Shelf life: 6 months from date of manufacture when stored as recommended.
• Supply: Direct China manufacturer (Shenzhen, Guangdong) offering OEM/ODM customization of hardness, viscosity, pot life, cure speed and colour, with free samples and bulk wholesale supply at factory-direct pricing.

About This Supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-8820A/B and what thermal conductivity does it offer?

A: HN-8820A/B is a two-component addition-cure thermally conductive silicone potting compound with a 1:1 mix ratio and a thermal conductivity of 2.0 ± 0.1 W/m·K for effective heat dissipation and thermal management.

Q2: Is HN-8820A/B flame retardant and how is it cured?

A: Yes, it offers UL 94 V-0 flame retardancy. Mix Component A and B at 1:1 by weight; cure at room temperature per pot life or heat accelerate at 80 °C for 10–20 min.

Q3: What are the electrical insulation and temperature performance?

A: It provides volume resistivity ≥ 5.0 × 10¹⁴ Ω·cm, Shore A 45–50 hardness, and maintains rubber elasticity from −40 °C to 150 °C with waterproof, moisture-proof and anti-ageing performance.

Q4: Which applications suit this thermally conductive potting compound?

A: It suits power modules, automotive HID lamp module power supplies, automotive ignition system module power supplies, network transformers, electronic components, PCBs, EV/BMS and LED drivers.

Q5: What are the MOQ, packaging and delivery time?

A: Minimum order quantity is 1 kg, supplied as 25 kg (A) + 25 kg (B) 50 kg/set kits. Free samples ship in 3–5 working days and bulk orders in 7–15 days; OEM/ODM customization is available.