This two-component, addition-cure (platinum-catalysed) silicone potting compound delivers an ultra-high thermal conductivity of 4.0±0.1 W/m·K, purpose-built for high-power electronic components with demanding heat dissipation and temperature resistance requirements. It is especially suited to photovoltaic and energy storage power equipment.
| Property | Unit | Value |
|---|---|---|
| Mix Ratio (A:B) | by weight | 1:1 |
| Mixed Viscosity (25°C) | mPa·s | 13000±2000 |
| Mixed Density (25°C) | g/cm³ | 2.95±0.02 |
| Pot Life / Operating Time (25°C) | min | 60–180 |
| Cure Time (Room Temp.) | h | 4–8 |
| Cure Time (Heat Accelerated, 80°C) | min | 30 |
| Hardness | Shore A | 45±8 |
| Thermal Conductivity | W/m·K | 4.0±0.1 |
| Volume Resistivity | Ω·cm | ≥1.0×1014 |
| Flame Retardancy | UL94 | V-0 |
| Operating Temperature Range | °C | −40 to 200 |
For industrial/professional use only. Wear nitrile gloves, safety goggles and protective clothing; avoid skin and eye contact and ensure adequate ventilation. Do not use in contact with condensation-cure (acetoxy) silicone, epoxy resin or polyurethane, and keep substrates free of sulfur, tin, amine, phosphorus and acidic contaminants to avoid cure inhibition.
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