This two-component addition-cure thermally conductive silicone potting compound delivers 2.0 W/m·K heat dissipation with a convenient 1:1 mix ratio. Cured at room or moderate temperature without low-molecular-weight by-products and with low shrinkage, it forms a durable, flame-retardant (UL94 V-0) protective barrier for deep-section potting of high-power electronics. It is engineered for 5G base station RRU/AAU power modules, microinverters, third-generation semiconductor (SiC/GaN) power module packaging and new-energy vehicle power batteries & thermal management systems.
| Item | Value |
|---|---|
| Model | HN-8820 |
| Type | Two-component, addition-cure thermally conductive silicone potting compound |
| Mix Ratio | 1:1 (A:B) |
| Color | Grey / White / Black |
| Viscosity (mixed, 25°C) | 2000–3000 cps |
| Hardness | 45–50 Shore A |
| Thermal Conductivity | 2.0 W/m·K (3.0 W/m·K available) |
| Flame Retardant Rating | UL94 V-0 |
| Service Temperature Range | -40°C to 150°C |
| Cure | Room / moderate temperature; addition cure, no by-products |
| Shelf Life | 6 months |
Shenzhen Hanast New Material is a leading R&D and production supplier of silicone potting compound in China, delivering full-process support from formulation to mass production. Products are RoHS compliant and tested for electrical insulation, thermal conductivity and anti-aging performance. OEM / ODM and custom formulations are available.
50 KG/set (A+B), 25 KG/barrel. Delivery within 5–7 days. Payment by T/T or PayPal.