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Thermally Conductive Potting Compound 3.0W/mK UL94 V-0 Silicone for Automotive ECU Electronic Control Module

Thermally Conductive Potting Compound 3.0W/mK UL94 V-0 Silicone for Automotive ECU Electronic Control Module

Product Details:
Place of Origin: Guangdong, China
Brand Name: Hanast
Certification: ROHS SGS
Model Number: HN-8830A/B
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
Hanast
Certification:
ROHS SGS
Model Number:
HN-8830A/B
Mix Ratio:
1:1 (A:B)
Thermal Conductivity:
3.0 W/m·K
Flame Retardant:
UL94 V-0
Temperature Range:
-40℃ ~ 200℃
Cure Time (25℃):
2-4 Hours
Feature:
Waterproof, Moisture-Proof, Excellent Insulation
Shelf Life:
6 Months
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Thermally Conductive Potting Compound 3.0W/mK

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Silicone Potting Compound for Automotive ECU

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UL94 V-0 Potting Compound

Trading Information
Minimum Order Quantity:
1 Kilogram
Packaging Details:
50KG/Set (Part A: 25KG + Part B: 25KG Drum)
Delivery Time:
7-10 Days
Payment Terms:
T/T
Supply Ability:
50 Tons per Month
Product Description
Thermally Conductive Potting Compound 3.0W/mK UL94 V-0 Silicone for Automotive ECU Electronic Control Module
3.0 W/mK Potting Compound HN-8830A/B for Automotive ECU & Electronic Control Modules

HN-8830A/B is a two-component 1:1 addition-cure thermally conductive silicone potting compound delivering 3.0 W/m·K thermal conductivity for automotive ECU and electronic control modules. It combines UL94 V-0 flame retardancy, excellent electrical insulation and a wide -40℃ to 200℃ operating range, providing reliable protection and heat dissipation for high-power automotive electronics.

Key Features
  • 3.0 W/m·K Thermal Conductivity — superior heat transfer for automotive ECU, sensors and power modules.
  • UL94 V-0 Flame Retardant — meets strict automotive fire-safety requirements.
  • Wide Temperature Range -40℃ ~ 200℃ — stable performance in engine compartments and extreme environments.
  • Excellent Insulation — high dielectric strength protects circuit boards and electronic components.
  • Waterproof & Moisture-Proof — full encapsulation shields modules from water, dust and corrosion.
  • 1:1 Mix Ratio, Easy Processing — 2-4 h cure at 25℃ for efficient production.
Applications
  • Automotive ECU (engine control units) and TCU
  • Electronic control modules and sensors
  • Power modules and circuit boards
  • New energy vehicle electronics
  • Industrial control and communication equipment
Technical Specifications
PropertyValue
Mix Ratio (A:B)1:1
Thermal Conductivity3.0 W/m·K
Flame RetardantUL94 V-0
Temperature Range-40℃ ~ 200℃
Cure Time (25℃)2-4 Hours
FeatureWaterproof, Moisture-Proof, Excellent Insulation
Shelf Life6 Months