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Thermally Conductive Silicone Encapsulant 2.0W/m·K UL94 V-0 Potting Gel for Motor Drive BMS RF Module Protection

Name: Thermally Conductive Silicone Encapsulant 2.0W/m·K UL94 V-0 Potting Gel for Motor Drive BMS RF Module Protection
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8820
Availability: InStock

Product Details:

Place of Origin:	Guangdong, China
Brand Name:	Hanast
Certification:	ROHS, REACH, UL94 V-0, ISO 9001
Model Number:	HN-8820

Detail Information

Place of Origin:

Guangdong, China

Brand Name:

Hanast

Certification:

ROHS, REACH, UL94 V-0, ISO 9001

Model Number:

HN-8820

Mix Ratio:

1:1 (A:B)

Thermal Conductivity:

2.0 W/m·K

Flame Retardant:

UL94 V-0

Density:

2.36 G/cm³

Pot Life (25℃):

60-120 Minutes

Cure Time (25℃):

2-4 Hours

Heat Cure (80℃):

10-20 Minutes

Substrate Adhesion:

Excellent On Most Substrates

Hardness:

45-50 Shore A

Temperature Range:

-40℃ ~ 150℃

Shelf Life:

6 Months

Highlight:

High Light

Highlight:

2.0W/m·K Motor Drive Potting Gel

UL94 V-0 BMS Silicone Encapsulant

RF Module Thermal Management Potting Compound

Trading Information

Minimum Order Quantity:

1 Kilogram

Price:

Negotiable

Packaging Details:

50KG/Set (Part A: 25KG + Part B: 25KG Drum)

Delivery Time:

5-7 Days

Payment Terms:

T/T

Supply Ability:

100 Tons per Month

Product Description

Thermally Conductive Silicone Encapsulant 2.0W/m·K UL94 V-0 Potting Gel for Motor Drive BMS RF Module Protection

Product Overview

HN-8820 is a thermally conductive two-component silicone encapsulant that safeguards sensitive electronics against overheating and environmental damage. With 2.0 W/m·K thermal conductivity, UL 94 V-0 self-extinguishing flame rating, and excellent adhesion to most substrates, this potting gel is engineered for motor drives, battery management systems (BMS), RF modules, and consumer electronics. The 1:1 mix ratio and solvent-free formulation ensure simple, reliable processing with outstanding thermal cycling resistance from -40°C to 150°C.

Performance Highlights

2.0 W/m·K Thermal Conductivity

High-density formulation (2.36 g/cm³) efficiently transfers heat away from power semiconductors in motor drives and BMS modules

UL 94 V-0 Self-Extinguishing

Critical fire safety compliance for industrial motor drives, automotive BMS, and consumer electronics

Excellent Substrate Adhesion

Bonds reliably to PCB, aluminum, copper, and most electronic housing materials without primer — eliminates delamination failure modes

Thermal Cycling Resistance

Remains elastic through repeated -40°C to 150°C temperature swings without cracking or losing adhesion

Solvent-Free & Low Outgassing

Addition-cure chemistry releases no solvents or by-products — safe for sealed electronic enclosures

1:1 Mix Ratio

Compatible with manual mixing and automated meter-mix dispensing systems

Flexible & Repairable

Remains elastic for stress relief and can be removed for component rework when needed

Applications

Motor Drives

Industrial VFD, servo drive, and motor controller power stage potting. 2.0 W/m·K thermal conductivity plus excellent adhesion prevents hot spots and delamination in high-vibration motor drive environments.

Battery Management Systems

BMS module encapsulation for EV, ESS, and industrial battery packs. Provides thermal management, electrical isolation, and flame-retardant protection for cell monitoring and balancing circuitry.

RF Modules & Communication

Potting for RF power amplifiers, antenna tuners, and wireless communication modules. Low dielectric constant formulation minimizes signal loss while protecting sensitive RF components.

Consumer Electronics

Power adapter, charger, and smart home device encapsulation. UL 94 V-0 safety compliance with solvent-free formulation for consumer product safety certifications.

Automotive Control Modules

ECU, TCU, and body control module potting with combined thermal management, vibration damping, and moisture protection for under-hood and cabin electronics.

Power Semiconductors

IGBT, MOSFET, and SiC power module encapsulation. High thermal conductivity formula handles high power density with reliable long-term adhesion under thermal cycling.

Bulk Supply & Quality Assurance

As a direct silicone encapsulant manufacturer with 40,000 sqm production facilities in Shenzhen, China, we provide competitive factory-direct pricing with ISO 9001 certified quality and 100 Tons/month capacity. 1KG MOQ for samples with complete TDS, MSDS, RoHS, and REACH documentation. Custom formulation available for density, adhesion, and cure profile optimization.

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Thermally Conductive Silicone Encapsulant 2.0W/m·K UL94 V-0 Potting Gel for Motor Drive BMS RF Module Protection

High Light

Highlight:

2.0W/m·K Motor Drive Potting Gel

UL94 V-0 BMS Silicone Encapsulant

RF Module Thermal Management Potting Compound

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