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Thermally Conductive Silicone Encapsulant 2.0W/m·K UL94 V-0 Potting Gel for Motor Drive BMS RF Module Protection

Name: Thermally Conductive Silicone Encapsulant 2.0W/m·K UL94 V-0 Potting Gel for Motor Drive BMS RF Module Protection
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8820
Availability: InStock

Detail Produk:

Tempat asal:	Guangdong, Tiongkok
Nama merek:	Hanast
Sertifikasi:	ROHS, REACH, UL94 V-0, ISO 9001
Nomor model:	HN-8820

Informasi Rinci

Tempat asal:

Guangdong, Tiongkok

Nama merek:

Hanast

Sertifikasi:

ROHS, REACH, UL94 V-0, ISO 9001

Nomor model:

HN-8820

Rasio campuran:

1: 1 (A: B)

Konduktivitas termal:

2,0 W/m·K

Tahan Api:

UL94 V-0

Kepadatan:

2.36 g/cm³

Kehidupan Pot (25℃):

60-120 Menit

Waktu Penyembuhan (25℃):

2-4 jam

Penyembuhan Panas (80℃):

10-20 menit

Adhesi Substrat:

Sangat baik pada Kebanyakan Substrat

Kekerasan:

45-50 Pantai A

Kisaran Suhu:

-40 ℃ ~ 150 ℃

Umur Simpan:

6 bulan

Menyoroti:

High Light

Menyoroti:

2.0W/m·K Motor Drive Potting Gel

UL94 V-0 BMS Silicone Encapsulant

RF Module Thermal Management Potting Compound

Informasi Perdagangan

Kuantitas min Order:

1 kilogram

Harga:

Dapat dinegosiasikan

Kemasan rincian:

50KG/Set (Bagian A: 25KG + Bagian B: Drum 25KG)

Waktu pengiriman:

5-7 hari

Syarat-syarat pembayaran:

T/T

Menyediakan kemampuan:

100 ton per bulan

Deskripsi Produk

Thermally Conductive Silicone Encapsulant 2.0W/m·K UL94 V-0 Potting Gel for Motor Drive BMS RF Module Protection Product Overview HN-8820 is a thermally conductive two-component silicone encapsulant that safeguards sensitive electronics against overheating and environmental damage. With 2.0 W/m·K thermal conductivity, UL 94 V-0 self-extinguishing flame rating, and excellent adhesion to most substrates, this potting gel is engineered for motor drives, battery management

Tag:

Thermally Conductive Silicone Encapsulant 2.0W/m·K UL94 V-0 Potting Gel for Motor Drive BMS RF Module Protection

High Light

Menyoroti:

2.0W/m·K Motor Drive Potting Gel

UL94 V-0 BMS Silicone Encapsulant

RF Module Thermal Management Potting Compound

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pasta konduktif termal,

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