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Thermal Conductive Potting Compound 2.0W/mK UL94 V-0 Low Viscosity Silicone for Charging Pile LED Driver PCB Protection

Thermal Conductive Potting Compound 2.0W/mK UL94 V-0 Low Viscosity Silicone for Charging Pile LED Driver PCB Protection

Product Details:
Place of Origin: Guangdong, China
Brand Name: Hanast
Certification: ROHS, REACH, UL94 V-0, ISO 9001
Model Number: HN-8820-IND
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
Hanast
Certification:
ROHS, REACH, UL94 V-0, ISO 9001
Model Number:
HN-8820-IND
Mix Ratio:
1:1 (A:B)
Thermal Conductivity:
2.0 W/mK
Flame Retardant:
UL94 V-0
Viscosity (Mixed):
5000-8000 CP (Customizable To 2000 CP)
Hardness:
45-50 Shore A
Dielectric Strength:
>25 KV/mm
Volume Resistivity:
>5.0E14 Ohm·cm
Cure Time (25℃):
4-6 Hours
Accelerated Cure (80℃):
30-60 Minutes
Temperature Range:
-40℃ ~ 150℃
Shelf Life:
6 Months
Highlight:

High Light

Highlight:

2.0W/mK Charging Pile Potting Compound

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Low Viscosity LED Driver Encapsulant

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UL94 V-0 PCB Protection Silicone Potting

Trading Information
Minimum Order Quantity:
1 Kilogram
Price:
Negotiable
Packaging Details:
50KG/Set (Part A: 25KG + Part B: 25KG Drum)
Delivery Time:
5-7 Days
Payment Terms:
T/T
Supply Ability:
50000 Kilograms per Month
Product Description
Thermal Conductive Potting Compound 2.0W/mK UL94 V-0 Low Viscosity Silicone for Charging Pile LED Driver PCB Protection
Thermally Conductive Potting Compound HN-8820-IND for Charging Pile & LED Driver PCB Protection

HN-8820-IND is a low-viscosity two-part addition-cure silicone potting compound specifically formulated for EV charging pile power modules, high-power LED driver encapsulation, industrial power supplies, and telecom equipment. With 2.0W/mK thermal conductivity, UL 94 V-0 flame retardancy, and excellent flow characteristics (5000-8000 cP, customizable to 2000 cP), this PCB protection potting compound fills tight spaces and complex geometries for complete electronic component protection in 24/7 outdoor and industrial environments.

Key Features for Industrial Electronics
  • Low Viscosity for PCB Potting: 5000-8000 cP with customizable lower options (2000 cP) ensures complete penetration around SMD components and tight PCB clearances
  • Fast Cure Capability: Room temperature cure in 2-4 hours or accelerated at 80°C in 30-60 minutes for high-throughput production lines
  • Moisture-Proof Sealing: Complete environmental barrier against humidity, condensation, and corrosive atmospheres
  • Anti-Vibration Damping: Flexible silicone absorbs mechanical shock and vibration for transportation and field-deployed equipment
  • Charging Pile Reliability: Engineered for 24/7 outdoor operation with excellent thermal cycling endurance from -40°C to 150°C
  • UL 94 V-0 Certified: Critical fire safety rating for high-power charging and industrial applications
  • Deep Section Cure: Addition-cure chemistry cures uniformly regardless of potting depth without releasing heat
  • Repairable: Unlike rigid epoxy potting, silicone remains removable for component rework and repair
Industrial & Infrastructure Applications

EV Charging Piles & Stacks
High-power DC fast charging module potting with combined thermal management and fire safety. Protects rectifier stacks, power modules, and control boards in 50kW-350kW charging stations exposed to 24/7 outdoor conditions.

High-Power LED Drivers
Outdoor street light and stadium light power supply waterproof encapsulation. 2.0W/mK thermal conductivity extends LED driver service life by efficiently dissipating operational heat through the potting compound.

Industrial Power Supplies
PCB-level protection for factory automation controllers, machinery control units, and industrial SMPS modules requiring vibration resistance and environmental sealing.

Telecom Equipment
RRU (Remote Radio Unit), baseband processing units, and network transformer moisture-proof potting for outdoor telecom infrastructure and 5G base stations.

Motor Drive Inverters
Industrial VFD (Variable Frequency Drive) and servo drive power stage potting. Absorbs mechanical vibration while providing high-voltage insulation for IGBT/MOSFET power modules.

Medical Power Supplies
Low-outgassing formulation compatible with clean room assembly environments for medical device power supply encapsulation.

PCB Protection: Silicone vs Alternatives
Protection Method Silicone Potting (HN-8820-IND) Conformal Coating Epoxy Potting
Coverage Complete 3D encapsulation Thin surface film only Complete but rigid
Moisture Barrier Excellent, full seal Moderate Excellent
Reworkability Removable for repair Difficult to remove Non-repairable
Thermal Management 2.0W/mK heat dissipation Minimal 0.5-1.0W/mK
Vibration Protection Shock absorbing Minimal Rigid, may crack
Custom Formulation & Bulk Supply

As a specialized charging pile potting compound manufacturer in Shenzhen, Guangdong, we offer lower viscosity options (2000-4000 cP), faster cure profiles, and bulk competitive factory-direct pricing with 50,000 KG/month capacity. 1KG MOQ for sample testing with complete TDS, MSDS, and RoHS/REACH documentation. Technical application engineering support provided for dispensing process optimization.