HN-8820 AB is a two-component 1:1 thermally conductive silicone encapsulant engineered for motor drive controllers, battery management systems (BMS) and RF modules. With 2.0 W/m·K thermal conductivity, UL94 V-0 flame retardancy and an optional fast heat cure of 10-20 minutes at 80℃, it delivers high-throughput potting with reliable thermal management and environmental protection.
| Property | Value |
|---|---|
| Mix Ratio (A:B) | 1:1 |
| Thermal Conductivity | 2.0 W/m·K |
| Flame Retardant | UL94 V-0 |
| Density | 2.36 g/cm³ |
| Hardness | 45-50 Shore A |
| Temperature Range | -40℃ ~ 150℃ |
| Pot Life (25℃) | 60-120 Minutes |
| Cure Time (25℃) | 2-4 Hours |
| Heat Cure (80℃) | 10-20 Minutes |
| Substrate Adhesion | Excellent on Most Substrates |
| Shelf Life | 6 Months |