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Thermally Conductive Silicone Encapsulant 2.0W/mK UL94 V-0 Fast Heat Cure Potting Gel for Motor Drive BMS Protection

Thermally Conductive Silicone Encapsulant 2.0W/mK UL94 V-0 Fast Heat Cure Potting Gel for Motor Drive BMS Protection

Product Details:
Place of Origin: Guangdong, China
Brand Name: Hanast
Certification: ROHS SGS
Model Number: HN-8820 AB
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
Hanast
Certification:
ROHS SGS
Model Number:
HN-8820 AB
Mix Ratio:
1:1 (A:B)
Thermal Conductivity:
2.0 W/m·K
Flame Retardant:
UL94 V-0
Density:
2.36 G/cm³
Hardness:
45-50 Shore A
Temperature Range:
-40℃ ~ 150℃
Pot Life (25℃):
60-120 Minutes
Cure Time (25℃):
2-4 Hours
Heat Cure (80℃):
10-20 Minutes
Substrate Adhesion:
Excellent On Most Substrates
Shelf Life:
6 Months
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Thermally conductive silicone encapsulant 2.0W/mK

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Fast heat cure potting gel

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Motor drive BMS protection potting compound

Trading Information
Minimum Order Quantity:
1 Kilogram
Packaging Details:
50KG/Set (Part A: 25KG + Part B: 25KG Drum)
Delivery Time:
5-7 Days
Payment Terms:
T/T
Supply Ability:
100 Tons per Month
Product Description
Thermally Conductive Silicone Encapsulant 2.0W/mK UL94 V-0 Fast Heat Cure Potting Gel for Motor Drive BMS RF Module Protection
Fast Heat Cure Potting Gel HN-8820 AB for Motor Drive, BMS & RF Modules

HN-8820 AB is a two-component 1:1 thermally conductive silicone encapsulant engineered for motor drive controllers, battery management systems (BMS) and RF modules. With 2.0 W/m·K thermal conductivity, UL94 V-0 flame retardancy and an optional fast heat cure of 10-20 minutes at 80℃, it delivers high-throughput potting with reliable thermal management and environmental protection.

Key Features
  • 2.0 W/m·K Thermal Conductivity — efficient heat dissipation for high-power motor drives and power electronics.
  • Fast Heat Cure (80℃) — cures in 10-20 minutes at 80℃, accelerating production throughput; 2-4 h at 25℃ for room-temperature curing.
  • UL94 V-0 Flame Retardant — meets stringent fire-safety standards for automotive and industrial electronics.
  • Excellent Substrate Adhesion — strong bonding to most substrates, protecting PCBs, IGBTs and inductors from vibration and moisture.
  • 1:1 Mix Ratio, Easy Dispensing — 45-50 Shore A soft elastomer with 60-120 min pot life for reliable automated potting.
  • Wide Temperature Range — stable from -40℃ to 150℃.
Applications
  • Motor drive controllers and inverters
  • Battery management system (BMS) modules
  • RF modules and communication power amplifiers
  • IGBT power modules and sensors
  • Industrial power supplies and new energy electronics
Technical Specifications
PropertyValue
Mix Ratio (A:B)1:1
Thermal Conductivity2.0 W/m·K
Flame RetardantUL94 V-0
Density2.36 g/cm³
Hardness45-50 Shore A
Temperature Range-40℃ ~ 150℃
Pot Life (25℃)60-120 Minutes
Cure Time (25℃)2-4 Hours
Heat Cure (80℃)10-20 Minutes
Substrate AdhesionExcellent on Most Substrates
Shelf Life6 Months