Thermally Conductive Silicone Encapsulant 2.0W/mK UL94 V-0 Fast Heat Cure Potting Gel for Motor Drive BMS RF Module Protection Fast Heat Cure Potting Gel HN-8820 AB for Motor Drive, BMS & RF Modules HN-8820 AB is a two-component 1:1 thermally conductive silicone encapsulant engineered for motor drive controllers, battery management systems (BMS) and RF modules . With 2.0 W/m·K thermal conductivity , UL94 V-0 flame retardancy and an optional fast heat cure of 10-20 minutes at