EV Battery & Automotive Electronics Silicone Potting Compound Manufacturer | 3.0 W/m·K High Thermal Conductivity (HN-8830)

EV Battery & Automotive Electronics Silicone Potting Compound Manufacturer | 3.0 W/m·K High Thermal Conductivity (HN-8830)

Product Overview:

Shenzhen Hanast New Materials Co., Ltd. manufactures HN-8830A/B, an  ISO 9001 certified 3.0 W/m·K high thermal conductivity silicone potting compound specifically formulated for Electric Vehicle (EV) battery modules, BMS units, automotive ignition systems, and DC-DC converters. Featuring a 1:1 mix ratio by weight and low mixed viscosity (11,000 mPa·s), HN-8830 provides excellent self-leveling fluidity to fill tight gaps in high-power automotive power electronics.

HN-8830 maintains long-term flexible elastomeric damping across continuous automotive operating temperatures from -40°C to +200°C, achieving UL 94 V-0 flame retardancy and high volume resistivity (≥ 1.0 × 10¹⁴ Ω·cm). It cures reliably at room temperature (4–8 hours at 25°C) or via heat acceleration (30 minutes at 80°C). Engineered as a direct factory alternative for thermal management in automotive OEMs, HN-8830 is supplied in 50 kg sets (25 kg A + 25 kg B plastic barrels) with full MSDS, COA, and Form E / RCEP origin certification for non-dangerous sea freight.

• EV Battery Modules & BMS: Thermal management and electrical insulation between battery cells, cooling plates, and management boards.

• Automotive DC-DC Converters & OBCs: Encapsulation for onboard power conversion units requiring high thermal dissipation.

• Ignition & HID Lighting Modules: Protection for high-voltage ignition systems and HID power modules under harsh engine bay temperatures.

A: Yes. Once cured, HN-8830 forms a durable Shore A 35 ± 8 elastomer that remains flexible from -40°C to +200°C. It dampens severe mechanical vibrations and absorbs thermal expansion stresses typical of automotive battery packs and engine compartments.

A: With a thermal conductivity of 3.0 ± 0.1 W/m·K (tested via GB/T 38712-2020), HN-8830 transfers heat away from high-power electronic components to heat sinks twice as fast as standard 1.5 W/m·K silicones, preventing hotspot accumulation and extending component life.