1:1 Mix Ratio UL 94 V-0 Flame Retardant 45 Shore A Silicone Potting Compound for Power Module Inverter Encapsulation

HN-8806A/B is a two-component platinum addition-cure silicone potting compound supplied as a 1:1 mix ratio by weight system. Component A is a white liquid and Component B is a grey liquid; after mixing, the compound cures at room temperature or under heat into a grey, flexible elastomer of 45 ± 5 Shore A hardness with a thermal conductivity of ≥ 0.76 W/m·K.

The cured elastomer combines flame retardancy to UL 94 V-0, volume resistivity of 1.0 × 10¹⁶ Ω·cm, dielectric strength of 25-30 kV/mm and an operating temperature range of -50 °C to 250 °C. It cures with extremely low shrinkage, releases no heat or by-products, and causes no corrosion to sealed components.

Typical users include power electronics manufacturers, EV battery pack assemblers, LED driver makers, automotive electronics suppliers and industrial control equipment builders who require a reproducible 1:1 dispensing process, long pot life and reliable dielectric insulation.

• Platinum addition cure system - no by-products, no exotherm, no corrosion to sealed metal parts; suitable for thick section potting.
• 1:1 mix ratio by weight - simple metering for meter-mix dispensing machines, dual cartridge guns and manual batch mixing.
• Pot life 18-24 minutes at 25 °C - enough working time for vacuum degassing, multiple cavity filling and production line dispensing.
• Fast heat accelerated cure - 12 minutes at 80 °C, 2-3 hours preliminary cure at 25 °C, supporting high throughput line cycling.
• Thermal conductivity ≥ 0.76 W/m·K - heat transfer from power modules, battery cells and LED boards to the housing.
• UL 94 V-0 flame retardancy - meets safety requirements for household appliances, chargers and energy storage cabinets.
• Dielectric strength 25-30 kV/mm, volume resistivity 1.0 × 10¹⁶ Ω·cm - electrical insulation for high voltage circuits and transformers.
• Deep section curing with extremely low cure shrinkage - nearly zero internal stress on delicate PCBA, no cracking of thick blocks.
• Wide operating temperature -50 °C to 250 °C - thermal shock and thermal cycling stability in outdoor and engine bay environments.
• Moisture proofing, waterproofing and ageing resistance - protects encapsulated electronics in humid, salt spray and harsh environments.
• RoHS compliant - meets EU and North America market access requirements.
• Low viscosity 2000-3000 mPa·s - excellent flow and penetration into dense PCBA, fine gaps, connectors and windings, with optional vacuum degassing.
• Batch consistency and 6 months shelf life - stable density 1.60 ± 0.05 g/cm³ and viscosity for automated production.

All values measured under standard conditions (25 °C, 50-60% RH) after the recommended cure schedule; for reference only.

Designed for potting, encapsulation, sealing and protection of electronic and electrical assemblies, including:

• Power modules, IGBT modules, rectifier bridges and power supply units
• EV battery packs, battery cell modules, BMS, OBC and energy storage cabinets
• LED drivers, LED power supplies, street light drivers and outdoor lighting modules
• Solar inverters, photovoltaic junction boxes and charging pile / EV charger components
• Automotive electronics: ECU, sensors, actuators, motor stator, car lamp drivers and on-board chargers
• Transformers, high voltage insulators, capacitors, reactors and busbars
• PCBA, circuit boards, connectors, cables, terminals and terminal blocks
• 5G communication equipment, base station power units, smart meters and IoT devices
• Industrial control equipment, transducers, leveling tables and automation sensors
• Medical wearable devices, smart home appliances and household electrical appliances
• Deep-section potting of thick parts, sensor probes and encapsulated magnetic components

1. Pre-mix: stir Component A and Component B separately before use, as fillers may settle during storage; reseal containers tightly after use.
2. Weighing: accurately weigh A and B at 1:1 by weight with a precision electronic scale; do not estimate by volume.
3. Mixing: mix thoroughly in the same direction and scrape container walls and bottom; uneven mixing causes local incomplete cure.
4. Degassing (optional): vacuum degas for void-sensitive applications.
5. Potting: pour the mixed compound into the clean, dry device within the 18-24 minute pot life and ensure complete coverage.
6. Curing: 2-3 hours preliminary cure at 25 °C, or 12 minutes at 80 °C for heat accelerated cure; do not move or stress the part during cure.

Cure inhibition warning: addition-cure silicone may fail to cure in contact with organotin or tin-containing silicones, sulfur and polysulfide compounds, amines, polyurethane rubber, ammonia-containing materials, phosphorus compounds, organic acids and solder flux residues. Clean substrates and tools before use.

• Component A: 25 kg plastic barrel; Component B: 25 kg plastic barrel; Kit (A+B): 50 kg per set.
• Store in original tightly sealed containers in a cool, dry and well-ventilated area at the recommended 25 °C.
• Protect from direct sunlight, moisture and extreme temperatures; keep away from food, children and incompatible materials.
• Shelf life: 6 months from date of manufacture under recommended storage conditions.
• Transportation: classified as non-dangerous goods (general chemicals); handle with care to prevent leakage.

Shenzhen Hanast New Materials Co., Ltd. is a manufacturer of liquid silicone rubber and potting compounds with in-house QC on viscosity, density, hardness, thermal conductivity and dielectric strength. We support OEM and ODM orders, custom colors, custom hardness, private label packaging and stable batch-to-batch consistency for automated dispensing lines.

Send your drawing, PCBA size, voltage class or battery module specification and we will recommend the matching grade and pack size. Contact us for a technical quotation today.