Transparent Condensation Cure RTV-2 Silicone Potting Compound with 10:1 Mix Ratio for LED Encapsulation

HN-8808A/B is a two-component condensation-cure (tin system) RTV-2 liquid silicone rubber supplied in a 10:1 ratio by weight. Component A is the base silicone and Component B is the curing agent; both are transparent liquids. After mixing, the compound cures at room temperature into a transparent, flexible elastomer that allows visual inspection of potted components.

The cured material offers dielectric strength ≥ 14 kV/mm, dielectric constant ≤ 3.0, elongation at break ≤ 100%, continuous operation from -50 °C to 200 °C, good adhesion to most substrates (especially aluminium), small chemical shrinkage and no exotherm during cure. It is waterproof and moisture-proof, protecting electronic assemblies from humidity.

Typical use: LED strip lights and flexible light strips, LED power supplies, waterproof power supplies, PCB potting and coating, lamps and luminaires, automotive electronic modules and aluminium substrate assemblies where a clear, inspectable encapsulation is required.

• Transparent cured elastomer - potted components, solder joints and LED chips remain visible for inspection, rework screening and quality audit.
• Condensation-cure RTV-2 tin system, 10:1 by weight - simple metering with a small curing agent package; no platinum catalyst, lower raw material cost.
• Room-temperature curing, no oven required - initial set then 8-24 hours full cure at 25 °C; optional gentle post-cure below 60 °C after initial set.
• Low mixed viscosity 2200-2600 mPa·s - flows into fine gaps, dense LED strips, wire channels and thin PCB housings.
• Good adhesion, especially to aluminium substrates - bonds to aluminium profiles, heatsinks and metal housings without primer in most cases.
• Non-corrosive and no exotherm - safe for copper traces, LED phosphor, gold wire bonding and temperature-sensitive components.
• Small chemical shrinkage - low internal stress on thin PCBs and flexible circuits, reducing warpage and LED displacement.
• Dielectric strength ≥ 14 kV/mm, dielectric constant ≤ 3.0 - electrical insulation for LED drivers, power supplies and low voltage electronics.
• Wide temperature resistance -50 °C to 200 °C - stable in outdoor signage, lamp housings and automotive interiors.
• Waterproof and moisture-proof - protects light strips, PCBs and modules in humid, outdoor and wash-down environments.
• Elongation at break up to 100% - flexible encapsulation absorbs bending, vibration and thermal cycling of flexible light strips.
• Two-component packaging for production - 20 kg + 2 kg and 10 kg + 1 kg kits fit manual and semi-automatic dispensing.
• Low density 0.94 ± 0.02 g/cm³ - lighter potted assemblies and lower material consumption per litre.

Values measured under standard conditions (25 °C, 50-60% RH) after the recommended cure schedule; actual performance may vary with application conditions.

For potting, encapsulation, sealing, coating and protection of the following products:

• LED strip lights, flexible light strips, COB and SMD light strips, neon flex and linear lighting
• LED power supplies, LED drivers, LED modules, light engines and lamp accessories
• Outdoor signage, channel letters, light boxes, display screens and decorative lighting
• PCB and PCBA potting, conformal coating, board-level waterproofing and protection
• Waterproof power supplies, adapters, chargers and small electrical appliances
• Automotive electronic modules, interior lighting, sensors and control boards
• Aluminium substrate assemblies, aluminium profiles and metal heatsink bonding
• Household appliances, kitchen and bathroom electrical parts, pumps and controllers
• Sensors, connectors, cable junctions and small electronic modules
• General electronic encapsulation requiring transparent, waterproof and insulating protection
• Light sources, lamps, luminaires, stage and architectural lighting fixtures

1. Pre-mix: stir Component A thoroughly to redisperse settled filler; shake or stir Component B (curing agent) well.
2. Weigh: weigh A and B at exactly 10:1 by mass on a precision scale; keep A and B separate and the work area clean and dry.
3. Mix: mix until uniform in colour, scraping walls and bottom; do not prepare too large a batch by hand because fluidity drops as curing starts. Cure is faster in summer and slower in winter.
4. Degas: vacuum degassing is recommended to remove entrapped air. Do not completely seal the device or heat above 100 °C before the curing mass has fully released.
5. Pot: pour the degassed compound into the clean, dry device and ensure complete coverage.
6. Cure: room-temperature cure; initial set allows the next process, complete cure takes 8-24 hours. After initial cure, gentle heating not exceeding 60 °C may be used to accelerate curing.

Critical process notes: the 10:1 mixed compound must NOT be heated immediately after mixing, only after initial cure and never above 60 °C. Small molecules are released during condensation cure, so keep the area ventilated and do not seal prematurely; if complete sealing is required, wait 3 days in summer or 7 days in winter. Reseal Components A and B immediately after opening to avoid moisture contamination.

• Component A: 20 kg or 10 kg iron / plastic drum; Component B: 2 kg or 1 kg plastic bottle.
• Kit options: 22 kg per set (20 kg + 2 kg) or 11 kg per set (10 kg + 1 kg).
• Store sealed at below 25 °C in a cool, dry, well-ventilated area away from direct sunlight, moisture, heat and extreme temperatures.
• Shelf life: 6 months from date of manufacture when unopened and properly sealed; best used within 3 months.
• After opening, reseal immediately and use as soon as possible; do not return unused mixed material to the original containers.

Shenzhen Hanast New Materials Co., Ltd. produces liquid silicone rubber and electronic potting compounds with in-house testing of viscosity, density, dielectric strength and cure performance. We supply LED lighting, power supply and automotive electronics manufacturers with stable formulations, custom colors and private label packaging, and support grade selection based on your housing geometry, dispensing equipment and cure schedule.

Send your LED strip specification, PCB size or housing drawing and our engineers will recommend the matching viscosity and pack size. Contact us for a technical quotation today.