250C Halogen-Free Silicone Potting Compound for EV Battery and Charging Station Encapsulation
HN-8806A/B is a two-component addition-cure (platinum) silicone potting compound supplied in a 1:1 mix ratio by weight. It cures at room temperature or in 12 minutes at 80 C into a flexible grey elastomer that protects motor stators, EV battery modules, charging station power boards and PV inverter assemblies. The cured material combines 0.76 W/mK thermal conductivity, 25-30 kV/mm dielectric strength and a -50 C to 250 C service range. The formulation is halogen-free, REACH and RoHS compliant, UL 94 V-0 flame retardant and releases no heat or by-products during cure, so sealed components are not corroded or stressed.
Key Features
- Halogen-free and REACH compliant formulation for EU and North American OEM supply chains.
- UL 94 V-0 flame retardancy with RoHS compliance for electronic assemblies.
- Wide service temperature -50 C to 250 C, suitable for under-hood and power electronics heat loads.
- Thermal conductivity 0.76 W/mK to move heat from windings and power devices into the housing.
- Dielectric strength 25-30 kV/mm and volume resistivity 1.0 x 10^16 Ohm.cm for reliable insulation.
- Deep-section curing in thick battery modules and large stator castings without voids or exotherm.
- Extremely low cure shrinkage and low stress on delicate windings, sensors and solder joints.
- No heat and no by-products released during cure; non-corrosive to sealed components.
- 1:1 mix ratio by weight with 18-24 min pot life for manual or meter-mix dispensing.
- ISO 9001 certified factory with TDS, MSDS and batch traceability for every shipment.

Application Coverage
HN-8806A/B is specified for insulation, moisture proofing, thermal management and mechanical protection in the following assemblies:
- Motor stator and coil encapsulation - winding insulation, vibration damping and heat transfer in servo motors, BLDC motors and automotive traction motors.
- EV battery systems - battery pack, battery module and BMS board potting for thermal runaway protection and vibration resistance.
- EV charging infrastructure - charging pile, charging station, AC/DC charging module and connector board encapsulation.
- Photovoltaic and energy storage - PV inverter, solar micro-inverter, hybrid inverter and ESS battery cabinet power boards.
- Power electronics - IGBT power module, MOSFET module, DC-DC converter, transformer, reactor and power supply units.
- Industrial and automotive electronics - sensor, controller, ECU, PCB and circuit board protection, under-hood electronics and rail traction control units.
- Lighting and appliances - LED driver, LED power supply, household appliance control board and smart device modules.
- Other equipment - submersible pump motor, wind power converter, 5G communication equipment and medical device electronics.

Technical Data (from TDS HANAST-TDS-004 Rev.1)
Before Mixing (Uncured Components)
| Property |
Test Method / Condition |
Unit |
Component A |
Component B |
| Appearance |
Visual |
- |
White liquid |
Grey liquid |
| Viscosity |
GB/T 10247-2008 / 25 C |
mPa.s |
2000-3000 |
2000-3000 |
| Density |
GB/T 13354 / 25 C |
g/cm3 |
1.60 +/- 0.05 |
1.60 +/- 0.05 |
After Mixing (A + B)
| Property |
Test Method / Condition |
Unit |
Value |
| Mix ratio (A:B) |
By weight |
- |
1:1 |
| Pot life / operating time |
25 C |
min |
18-24 |
| Cure time (room temperature) |
25 C |
h |
2-3 (preliminary) |
| Cure time (heat accelerated) |
80 C |
min |
12 |
Cured Properties
| Property |
Test Method / Condition |
Unit |
Value |
| Appearance |
Visual |
- |
Grey elastomer |
| Hardness |
GB/T 531.1-2008 |
Shore A |
45 +/- 5 |
| Thermal conductivity |
GB/T 10297-1998 |
W/m.K |
>= 0.76 |
| Coefficient of thermal expansion |
GB/T 20673-2006 |
um/(m.C) |
210 |
| Volume resistivity |
GB/T 1692-92 / DC 500 V |
Ohm.cm |
1.0 x 10^16 |
| Dielectric strength |
GB/T 1693-2007 / 25 C |
kV/mm |
25-30 |
| Flame retardancy |
UL 94 |
Class |
V-0 |
| Operating temperature range |
- |
C |
-50 to 250 |
Values are measured at 25 C, 50-60% RH after the recommended cure schedule and are for reference only.
Mixing and Application
- Pre-mix: stir Component A and Component B separately before use because fillers may settle during storage; reseal containers immediately.
- Weighing: weigh A and B at exactly 1:1 by weight on a precision electronic scale.
- Mixing: mix in one direction and scrape the container walls and bottom to avoid local incomplete cure.
- Degassing (optional): vacuum degas for void-sensitive battery and IGBT modules.
- Potting: pour within the 18-24 min pot life and ensure complete coverage of windings, terminals and components.
- Curing: cure 2-3 h at 25 C or 12 min at 80 C; do not move or stress the part during cure.
Cure Inhibition Notice
This addition-cure silicone may fail to cure in contact with organotin or tin-containing silicones, sulfur and polysulfide compounds, amines, polyurethane rubber, ammonia-containing items, phosphorus compounds, organic acids and solder flux residues. Clean all substrates and tools before potting and do not mix with condensation-cure (acetoxy) silicone, epoxy or polyurethane.
Supply, OEM and Technical Support
- ISO 9001 certified factory in Shenzhen, Guangdong, China with 50 tons per month capacity.
- OEM / ODM private label - custom color, drum labels and kit sizes for brand owners and distributors.
- Free sample and 1 kg trial kit for heat ageing, thermal cycling and process validation before bulk ordering.
- Technical support - application engineering guidance on mix ratio, pot life, degassing, cure schedule and cure inhibition troubleshooting.
- Documentation - TDS, MSDS, RoHS and REACH declarations and batch COA issued with every shipment.
- Packaging - Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, 50 kg per set, export carton on pallet.
- Shelf life - 6 months from date of manufacture in original sealed containers at 25 C, protected from sunlight and moisture.
- Transportation - classified as non-dangerous goods (general chemicals).
FAQ
Q1: Is HN-8806A/B halogen-free and REACH compliant?
A: Yes. The formulation is halogen-free, RoHS compliant and REACH compliant, and it is UL 94 V-0 flame retardant, so it meets the documentation requirements of EU and North American OEM projects.
Q2: Can it be used for EV battery and charging station potting?
A: Yes. With 0.76 W/mK thermal conductivity, 25-30 kV/mm dielectric strength and a -50 C to 250 C range, it is used for EV battery modules, BMS boards, charging pile power modules and charging station connectors.
Q3: What is the pot life and cure schedule on a production line?
A: Pot life is 18-24 min at 25 C. Cure 2-3 h at room temperature, or 12 min at 80 C for heat-accelerated lines; deep sections cure without exotherm or by-products.
Q4: Does the cured compound stress delicate components?
A: No. Shore A 45 +/- 5 hardness, extremely low cure shrinkage and low stress protect windings, sensors and solder joints during thermal cycling and vibration.
Q5: What are the MOQ, packaging, lead time and sample policy?
A: Standard packaging is 25 kg per component barrel, 50 kg per A+B set. MOQ is one 50 kg set, a 1 kg trial kit and free sample are available, stock ships in 3-7 working days and bulk orders in 10-15 days. OEM private label is available from our ISO 9001 factory.
About Hanast
Shenzhen Hanast New Materials Co., Ltd. manufactures liquid silicone materials at a production base in Guangdong, China, supplying addition-cure and condensation-cure silicone for electronic potting, thermal management and mould making. Every lot ships with TDS and MSDS documentation and complies with RoHS, REACH and UL 94 V-0 requirements.

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