Low Outgassing Solvent-Free Silicone Potting Compound with No Exotherm and 1:1 Mix Ratio Platinum Addition-Cure Silicone Encapsulant

Low Outgassing Solvent-Free Silicone Potting Compound for Outdoor and Portable Power Electronics

HN-8806A/B is a solvent-free, two-component platinum addition-cure silicone potting compound that cures with no exotherm and no by-product release, keeping sealed cavities free of volatile contamination. The 1:1 mix ratio, 2000-3000 mPa.s flow and 18-24 min pot life suit manual potting and dual-pump dispensing, while the cured 45 +/- 5 Shore A elastomer delivers 0.76 W/mK thermal conductivity, 25-30 kV/mm dielectric strength, UL 94 V-0 flame retardancy, low stress and elastic service from -50 C to 250 C. It is halogen-free, REACH and RoHS compliant and supplied with batch COA from an ISO 9001 factory.

Key Features

• Low outgassing, solvent-free system - no solvent carrier and no by-products during cure, so sealed sensors, optical parts and relay cavities stay clean.
• No exotherm in thick sections - deep castings cure without heat spikes that stress bond wires, lenses or MEMS elements.
• Low stress and low shrinkage - Shore A 45 +/- 5 with 210 um/(m.C) CTE keeps stress low on windings, PCBs and solder joints.
• Halogen-free, REACH and RoHS compliant, UL 94 V-0 - meets EU and North American documentation and flammability requirements.
• 25-30 kV/mm dielectric strength and 1.0 x 10^16 Ohm.cm volume resistivity for dense low-voltage and high-voltage layouts.
• 0.76 W/mK thermal conductivity - transfers heat from power devices and battery cells into the housing.
• Ageing and moisture resistance - stable elasticity for outdoor cabinets, humid sites and thermal cycling.
• 1:1 by weight, 18-24 min pot life, 2000-3000 mPa.s - works with cartridges, manual batching and meter-mix lines.
• Dual cure schedule - 2-3 h at 25 C for field work, 12 min at 80 C for volume production.
• ISO 9001 factory, batch COA, TDS and MSDS with lot traceability for every shipment.

Application Coverage

• E-bike and light electric vehicles - e-bike battery pack, controller, motor hall sensor, scooter battery module and LEV charger board.
• Power tools and garden equipment - cordless drill battery pack, brushless motor controller, garden tool control board and charger.
• Outdoor and horticultural lighting - street light driver, grow light power supply, floodlight driver and landscape lighting module.
• Agriculture and irrigation - irrigation controller, valve actuator, soil sensor, greenhouse climate controller and pump inverter.
• Cleanroom and semiconductor equipment - cleanroom sensor, semiconductor handling module, vacuum chuck electronics and analytical instrument board.
• Sealed sensors and optics - pressure sensor, MEMS module, optical sensor, camera module and laser distance sensor.
• Energy and power - battery swap station module, BESS rack, PV inverter, charging pile, UPS and welding machine control board.
• Industrial and transport - motor stator, transformer, IGBT power module, servo drive, rail traction unit and marine instrument housing.
• Harsh environment - downhole telemetry, subsea connector, mining enclosure, port crane drive and hydrogen fuel cell stack.

Technical Data (from TDS HANAST-TDS-004 Rev.1)

Before Mixing (Uncured Components)

After Mixing (A + B)

Cured Properties

Values are measured at 25 C, 50-60% RH after the recommended cure schedule and are for reference only.

Mixing and Application

1. Pre-mix: stir Component A and Component B separately before use because fillers may settle; reseal containers immediately.
2. Weighing: weigh A and B at exactly 1:1 by weight with a precision scale.
3. Mixing: mix in one direction and scrape the container walls and bottom to avoid local uncured spots.
4. Degassing (optional): vacuum degas for void-sensitive sensors, optical modules and sealed cavities.
5. Potting: pour within the 18-24 min pot life and ensure complete coverage of the device.
6. Curing: cure 2-3 h at 25 C or 12 min at 80 C; do not move or stress the part during cure.

Cure Inhibition Notice

Supply, OEM and Technical Support

• ISO 9001 certified factory in Shenzhen, Guangdong, China with 50 tons per month capacity and lot traceability.
• Technical support - application engineering on outgassing concerns, degassing, mix ratio, pot life and cure schedule.
• OEM / ODM private label - custom hardness, custom color, drum labels and kit sizes on request.
• Free sample and 1 kg trial kit for outgassing, ageing and process validation before bulk ordering.
• Documentation - TDS, MSDS, RoHS and REACH declarations and batch COA with every shipment.
• Packaging - Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, 50 kg per set, export carton on pallet.
• Shelf life - 6 months from date of manufacture in sealed containers at 25 C, away from sunlight and moisture.
• Transportation - classified as non-dangerous goods (general chemicals).

FAQ

Q1: Does the compound release solvent or by-products during cure?

A: No. The system is solvent-free and cures by platinum addition with no exotherm and no by-product release, so sealed sensor, optical and relay cavities stay free of volatile contamination.

Q2: Why does no exotherm matter for potted electronics?

A: Thick and deep sections cure without heat spikes, so bond wires, lenses, MEMS elements and battery cells are not thermally stressed during the cure, and the low shrinkage keeps dimensions stable.

Q3: Is it suitable for e-bike, power tool and outdoor lighting modules?

A: Yes. Ageing and moisture resistance with a -50 C to 250 C range, 0.76 W/mK thermal conductivity and UL 94 V-0 flame retardancy suit e-bike battery packs and controllers, power tool battery packs, street light and grow light drivers.

Q4: Can it be used in cleanroom or semiconductor equipment?

A: The solvent-free, low outgassing cure makes it suitable for cleanroom sensors, semiconductor handling modules and analytical instrument boards where volatile contamination must be avoided.

Q5: What are the MOQ, packaging, lead time and sample policy?

A: Standard packaging is 25 kg per component barrel, 50 kg per A+B set. MOQ is one 50 kg set, a 1 kg trial kit and free sample are available, stock ships in 3-7 working days and bulk orders in 10-15 days. OEM private label is available.

About Hanast

Shenzhen Hanast New Materials Co., Ltd. manufactures liquid silicone materials at a production base in Guangdong, China, supplying addition-cure and condensation-cure silicone for electronic potting, sensor and optical encapsulation, thermal management and mould making. Every lot ships with TDS and MSDS documentation and complies with RoHS, REACH and UL 94 V-0 requirements.