Self-Levelling 2.0 W/m·K Thermally Conductive Potting Compound HN-8820A/B for Automotive HID Lamp and Ignition Module Encapsulation
HN-8820A/B is a two-component addition-cure (platinum-catalysed) thermally conductive silicone potting compound. Both components are 5000-8000 mPa·s liquids mixed at 1:1 by weight, giving good fluidity and self-levelling flow that fills tall cavities and dense automotive module housings without voids. The cured elastomer delivers 2.0 ± 0.1 W/m·K thermal conductivity, ≥ 5.0 × 1014 Ω·cm volume resistivity, UL 94 V-0 flame retardancy and Shore A 45-50 hardness over −40 C to 150 C, so HID lamp module power supplies, ignition module electronics and network transformers can be encapsulated and heat-sinked in a single pour.
Key Features
- Self-levelling low-stress flow - 5000-8000 mPa·s mixed viscosity spreads evenly around tall components, coils and connector pins, releasing trapped air without vacuum equipment.
- 2.0 ± 0.1 W/m·K thermal conductivity - tested to GB/T 38712-2020, carrying heat from ballast transistors, ignition coils and transformer cores into the housing wall.
- 1:1 mix ratio by weight - simple weighing or meter-mix processing, tolerant of manual and automated dispensing.
- 10-20 min cure at 80 C - heat-accelerated cure for high-volume lines, with room-temperature cure following the pot life for low-volume and repair work.
- UL 94 V-0 flame retardancy - V-0 rated for automotive, lighting and power equipment safety requirements, with RoHS compliance.
- ≥ 5.0 × 1014 Ω·cm volume resistivity - GB/T 31838.2-2019 tested insulation for HID ballast, ignition coil drivers and transformer windings.
- Waterproof, moisture-proof and anti-ageing - seals connectors and terminals against humidity, splash and long-term ageing in outdoor and under-hood environments.
- Shore A 45-50 elastomer - absorbs vibration and thermal cycling movement without stressing ceramic parts or solder joints.
- Bulk supply - 25 kg plastic barrel per component, 50 kg per A+B set, with TDS, MSDS and batch COA for every shipment.

Mixing and Application
- Pre-mix - stir Component A thoroughly before use because fillers may settle in storage; shake or stir Component B until homogeneous.
- Weigh - weigh A and B at 1:1 by weight, not by volume, on a precision electronic scale.
- Mix - mix until the colour is uniform and scrape the container walls and bottom; avoid whipping in excess air.
- Degas (optional) - vacuum degas for void-sensitive HID ballast and ignition coil assemblies.
- Pot - pour within pot life into a clean, dry housing and let the self-levelling compound find its own level.
- Cure - 10-20 min at 80 C with even heating, or allow room-temperature cure; do not move or stress the part during cure.
Application Coverage
HN-8820A/B is specified for insulation, moisture proofing, thermal management and mechanical protection in the following assemblies:
Automotive modules
- Automotive HID lamp module - HID ballast, xenon headlamp power supply, LED headlamp driver and lamp control module encapsulation.
- Automotive ignition module - ignition coil driver, ignition control module, spark module and engine bay sensor electronics.
- Automotive electronics - ECU housing, motor drive board, ADAS camera module and under-hood control unit.
Power electronics and communication
- Network transformer - LAN transformer, common mode choke, planar transformer and magnetic component potting.
- Power module - SiC and GaN third-generation semiconductor power module, IGBT module, MOSFET module and rectifier bridge.
- 5G equipment - 5G base station RRU/AAU power board, RF power amplifier module and remote radio unit heat path.
- Converter and inverter - microinverter, string inverter, DC-DC converter, OBC and power supply unit.
Energy, transport and industry
- EV battery and charging - battery module, BMS board, charging pile and charging station power board.
- Energy storage - BESS battery cabinet power board and PCS module.
- Rail transit - traction converter control board, auxiliary power module and trackside signalling electronics.
- Wind power and marine - wind turbine converter board, nacelle control electronics and offshore power unit.
- Industrial control - PLC module, industrial controller, sensor, transducer, energy meter and smart meter sealing.
- Medical and laboratory equipment - medical device power supply, diagnostic instrument board and laboratory power module.
- Lighting and appliances - LED driver, LED power supply, street lamp driver and household appliance control board.

Technical Data (TDS HANAST-TDS-005 Rev.1)
Before Mixing (Uncured Components)
| Property |
Test Method / Condition |
Unit |
Component A |
Component B |
| Appearance |
Visual |
- |
White liquid |
Grey liquid |
| Base chemistry |
- |
- |
Polysiloxane |
Polysiloxane |
| Viscosity |
GB/T 2794 / 25 C |
mPa·s |
5000-8000 |
5000-8000 |
| Density |
GB/T 13354 / 25 C |
g/cm3 |
2.0 ± 0.02 |
2.0 ± 0.02 |
After Mixing (A + B)
| Property |
Test Method / Condition |
Unit |
Value |
| Mix ratio (A:B) |
By weight |
- |
1:1 |
| Mixed viscosity |
25 C |
mPa·s |
5000-8000 |
| Cure time (heat accelerated) |
80 C |
min |
10-20 |
Cured Properties
| Property |
Test Method / Condition |
Unit |
Value |
| Appearance |
Visual |
- |
Grey elastomer |
| Hardness |
GB/T 531.1 |
Shore A |
45-50 |
| Thermal conductivity |
GB/T 38712-2020 |
W/m·K |
2.0 ± 0.1 |
| Volume resistivity |
GB/T 31838.2-2019 / DC 500 V |
Ω·cm |
≥ 5.0 × 1014 |
| Flame retardancy |
UL 94 |
Class |
V-0 |
| Operating temperature range |
- |
C |
−40 to 150 |
Values are measured at 25 C and 50-60% RH after the recommended cure schedule and are for reference only.
Cure Inhibition Notice
This addition-cure silicone may fail to cure in contact with organotin or tin-containing silicones, sulfur and polysulfide compounds, amine or ammonia-containing items, polyurethane rubber, phosphorus compounds, organic acids and solder flux residues. Clean substrates and tools before potting and do not mix with condensation-cure (acetoxy) silicone, epoxy or polyurethane.
Packaging, Bulk Supply and Logistics
- Bulk kit - Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, 50 kg per A+B set.
- Documentation - TDS, MSDS and batch COA issued with every shipment, with RoHS declaration for automotive and export projects.
- Stock and lead time - stock sets ship in 3-7 working days, bulk production in 10-15 days.
- Storage - 6 months shelf life in original sealed containers at 5-25 C, protected from sunlight and moisture.
- Transport classification - classified as non-dangerous goods (general chemicals); barrels palletised and strapped to prevent leakage.
- Supply capacity - 50 tons per month with OEM and private label service for distributors and brand owners.
FAQ
Q1: What makes HN-8820A/B different from other 2.0 W/mK potting compounds?
A: It is a self-levelling 1:1 addition-cure system with 5000-8000 mPa·s mixed viscosity, so it fills tall automotive module housings and dense transformer cavities without voids, while curing in 10-20 minutes at 80 C for high-volume lines.
Q2: Can it be used for automotive HID lamp modules and ignition modules?
A: Yes. The TDS lists automotive HID lamp module power supplies and ignition system module power supplies as typical applications, backed by 2.0 W/m·K thermal conductivity, UL 94 V-0 flame retardancy and a −40 C to 150 C service range.
Q3: What are the electrical insulation and flammability ratings?
A: Volume resistivity is ≥ 5.0 × 1014 Ω·cm tested to GB/T 31838.2-2019 at DC 500 V, and the cured compound is UL 94 V-0 flame retardant, so it insulates ballast, coil driver and transformer windings while meeting flammability requirements.
Q4: How is the product processed and cured?
A: Weigh Component A and B at exactly 1:1 by weight, mix until the colour is uniform, degas if void-sensitive, then pour within pot life. Heat-accelerated cure is 10-20 min at 80 C with even heating; room-temperature cure follows the pot life of the mixed compound.
Q5: What packaging, shelf life and transport classification apply?
A: Each component is supplied in a 25 kg plastic barrel, 50 kg per A+B set, from a 50 ton per month supply. Shelf life is 6 months sealed at 5-25 C, and the product is classified as non-dangerous goods for transport.
About Hanast
Shenzhen Hanast New Materials Co., Ltd. develops and manufactures liquid silicone materials for electronic potting, thermal management and mould making, supplying OEM and private label programmes worldwide. Every lot ships with TDS and MSDS documentation and is tested for thermal conductivity, electrical insulation and anti-ageing performance.

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