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Industrial Controller & Micro Inverter Silicone Potting Compound Manufacturer | 3.0 W/m·K Thermal Addition Silicone (HN-8830)

Industrial Controller & Micro Inverter Silicone Potting Compound Manufacturer | 3.0 W/m·K Thermal Addition Silicone (HN-8830)

Product Details:
Place of Origin: Guangdong, China
Brand Name: HANAST
Certification: Rohs、UL
Model Number: HN-8830A/B
Document: HANAST_TDS_HN-8830( 3.0W_mÂ...K).pdf
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
HANAST
Certification:
Rohs、UL
Model Number:
HN-8830A/B
Breakdown Voltage:
≥10000
Thermal Conductivity:
3.0 W/m·K
Feature:
Low Shrinkage Adn Low Viscosity
Cure Time:
4-6 H
Apply For:
Electric Control Units
Flame Retardant:
UL94 V-0
Operatingtemperaturerange:
-50°C To 200°C
Type:
Two-Component
Productname:
Thermally Conductive Potting Compound
Customization:
Custom Formulation Supported
Main Raw Material:
Silicone
Total Cure Time:
4-6H (25℃)
Shelf Life:
6 Months
Highlight:

High Light

Highlight:

Industrial Controller silicone potting compound

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Micro Inverter thermal conductive silicone

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3.0 W/m·K thermally conductive potting

Trading Information
Minimum Order Quantity:
50KG
Price:
$8-$12
Packaging Details:
50KG/set
Delivery Time:
5-8work days
Payment Terms:
T/T
Supply Ability:
100ton/month
Product Description

Industrial Controller & Micro Inverter Silicone Potting Compound Manufacturer | 3.0 W/m·K Thermal Addition Silicone (HN-8830)


Product Overview:

Shenzhen Hanast New Materials Co., Ltd. manufactures HN-8830A/B, a premium addition-cure (platinum-catalyzed) 3.0 W/m·K high thermal conductivity silicone potting compound developed for industrial PLC controllers, frequency converters, micro inverters, and heavy-duty power circuit boards. Featuring a 1:1 mix ratio by weight, a density of 2.95 g/cm³, and self-leveling viscosity (11,000 mPa·s), HN-8830 ensures complete void-free filling in deep-section PCB potting applications.

HN-8830 maintains flexible elastomeric protection (Shore A 35 ± 8) across continuous service temperatures from -40°C to +200°C, offering high dielectric strength, high volume resistivity (≥ 1.0 × 10¹⁴ Ω·cm), and UL 94 V-0 flame retardancy. It cures at room temperature (4–8 hours at 25°C) or via heat acceleration (30 minutes at 80°C). Packaged in 50 kg sets (25 kg A + 25 kg B plastic barrels), we provide factory-direct supply with complete GHS SDS/MSDS for non-dangerous sea freight and Form E / RCEP certificates.

2. Technical Specifications & Performance Matrix

Technical Data Sheet (HANAST HN-8830 Industrial Control Grade)

2.1 Liquid Uncured Properties (at 25°C)


PropertyTest Method / ConditionUnitComponent AComponent BMixed (A+B)
AppearanceVisual—White liquidGrey liquidGrey elastomer (cured)
Chemistry——PolysiloxanePolysiloxaneAddition-cure Platinum System
Mix RatioBy Weight———1 : 1
Mixed ViscosityGB/T 2794 (25°C)mPa·s10,500 ± 2,0009,500 ± 2,00011,000 ± 2,000
Mixed DensityGB/T 13354 (25°C)g/cm³2.95 ± 0.022.95 ± 0.022.95 ± 0.02
Pot Life25°C / 100g mixMinutes——60 – 180 mins

2.2 Physical & Electrical Cured Properties


Cured PropertyTest Method / ConditionUnitTechnical Specification Value
Thermal ConductivityGB/T 38712-2020W/m·K3.0 ± 0.1 W/m·K
HardnessGB/T 531.1Shore A35 ± 8 Shore A
Volume ResistivityGB/T 31838.2-2019 / DC 500VΩ·cm≥ 1.0 × 10¹⁴ Ω·cm
Flame RetardancyUL 94ClassUL 94 V-0 Certified
Operating TemperatureContinuous°C-40°C to +200°C
Room Temp. Cure Time25°CHours4 – 8 Hours
Heat-Accelerated Cure80°CMinutes30 Minutes

3. Direct Factory Alternatives & Performance Cross-Reference


Specification FeatureStandard Epoxy Potting ResinsHANAST HN-8830 Addition Silicone PDFFactory Advantage
Thermal Shock ResistanceRigid; prone to cracking under thermal stressFlexible Shore A 35 ± 8 elastomerZero mechanical stress on delicate solder joints and micro-components
Thermal ConductivityStandard 0.5 – 1.0 W/m·K3.0 ± 0.1 W/m·KAdvanced thermal management for high-power industrial control units
Chemical SafetyContains hazardous hardenersAddition-cure polysiloxaneEnvironmentally friendly, no toxic volatile byproducts during cure

4. Key Application Scenarios

  • Industrial Controllers & PLCs: Encapsulation for heavy-duty industrial automation boards and motor drive modules.

  • Solar Micro Inverters & Converters: Potting protection for compact outdoor micro inverters subject to continuous solar radiation.

  • Switching Power Supplies: Deep-section potting for industrial switching power supplies and high-voltage transformers.

5. Frequently Asked Questions (FAQ) Module

Q1: What is the recommended application procedure to avoid uncured surface defects?

A: Pre-mix Component A thoroughly before use as dense thermal fillers may settle during storage. Shake or stir Component B well. Weigh A and B accurately at a 1:1 ratio by weight using a precision electronic scale. Mix thoroughly, scrape container walls, and optionally vacuum degas for void-free results. Ensure components do not contact organotin, sulfur, amines, or flux residues to prevent platinum catalyst inhibition.

Q2: What packaging sizes and export shipping options are available for bulk buyers?

A: HN-8830 is supplied in 50 kg kit sets (25 kg Component A + 25 kg Component B plastic barrels). It carries a shelf life of 6 months when stored between 5–25°C in sealed original containers. Classified as non-dangerous general chemical goods, it is easy and cost-effective to ship via standard sea freight containers with our SDS/MSDS and Form E / RCEP documentation.


Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
0%
3 stars
0%
2 stars
0%
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0%

All Reviews

M
m*m
South Korea Aug 5.2026
High quality,very fast response,recommend
S
S*r
Germany Jun 3.2026
We’ve been using Hanast’s thermal conductive potting compound (2.0 W/m·K) for our energy storage system (ESS) modules for over a year. It performs exceptionally well in thermal management and has successfully passed rigorous UL94 V-0 flame-retardant and thermal shock tests