2025-09-11
Application Pain Points: The internal amplifier chip heats up during use, and the speaker faces frequent vibration and the risk of falling during transport. Furthermore, the internal magnets can attract metal debris and cause short circuits.
Solution: Potting the power management board and amplifier board. This 1:1 mixing method is simple and quick, even for low-volume repair shops.
Core Value: Improved Durability: Excellent vibration resistance protects the chip and solder joints, preventing "vibration" issues. Heat Dissipation and Insulation: The thermal conductivity of the colloid helps dissipate heat from the chip and secures all components, preventing short circuits and improving product quality.