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Latest company case about Shenzhen Hanast New Material co.,LTD Certifications

Q: Why does the potting compound bubble or delaminate after reflow soldering?

2025-10-14

Latest company case about Q: Why does the potting compound bubble or delaminate after reflow soldering?

A: The moisture adsorbed inside or at the bottom of the potting compound vaporizes rapidly at high temperatures. Ensure that the PCB is fully baked and dried before potting, and choose a low-humidity adhesive.

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