2026-07-02
Silicone gel, as an organosilicon material, can be used for extended periods at temperatures ranging from -40℃ to 180℃, while also exhibiting excellent weather resistance and electrical properties. Silicone gel has relatively low mechanical strength, with a modulus between 10³ and 10⁵ Pa, and experiences minimal stress during thermal changes. It is quite soft, with its hardness often expressed as penetration. Despite its softness, after deformation due to pressure or stretching, it recovers its original state due to the presence of cross-linking points, demonstrating self-healing capabilities and excellent shock absorption. Furthermore, its excellent hydrophobicity and good adhesion to substrates allow it to effectively isolate electronic components from the external environment after potting.
Silicone gel provides four major protective functions for electronic components:
It can be used for coating or potting. Its transparent or semi-transparent appearance facilitates the inspection of component faults, and after repair, only repotting is required. Its properties are also easily controlled; for example, the hardness after curing can be adjusted by different A/B ratios, and the curing speed can be controlled by different factors such as catalysts, inhibitors, and temperature. Adding functional materials can achieve thermal and electrical conductivity.
These numerous applications make it the ideal choice for protecting: