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Ultra-Soft Two-Component 1:1 Silicone Gel Potting Compound for IGBT Module Encapsulation Protection

Ultra-Soft Two-Component 1:1 Silicone Gel Potting Compound for IGBT Module Encapsulation Protection

Λεπτομέρειες προϊόντος:
Place of Origin: Guangdong, China
Μάρκα: Hanast
Πιστοποίηση: RoHS, SGS
Model Number: HN-6607A/B
Έγγραφο: HANAST_TDS_HN-6607—Electr...el.pdf
Λεπτομέρειες
Place of Origin:
Guangdong, China
Μάρκα:
Hanast
Πιστοποίηση:
RoHS, SGS
Model Number:
HN-6607A/B
Main Raw Material:
Silicone
Classification:
Two-Component Addition Cure Silicone Gel
Mix Ratio:
1:1 by weight
Appearance:
Transparent liquid
Viscosity (A/B, 25C):
300-500 mPa.s
Mixed Viscosity (25C):
300-500 mPa.s
Pot Life (25C):
120-180 min
Cured Dielectric Strength:
2.8-3.2 kV/mm
Curing Condition:
Room temperature or 60-80 C
Application:
IGBT Module Encapsulation, Electronic Component Potting
Shelf Life:
6 months
Storage Temperature:
Below 25 C
Επισημαίνω:

High Light

Επισημαίνω:

Ultra-Soft Stress-Free Encapsulation

,

Low Viscosity Deep Penetration Potting

,

Adjustable Medium-Temperature Cure

Πληροφορίες συναλλαγών
Minimum Order Quantity:
1 kilogram
Τιμή:
Διαπραγματεύσιμα
Packaging Details:
Component A 25 kg plastic barrel, Component B 25 kg plastic barrel; 50 kg kit per set
Delivery Time:
3-4 days
Payment Terms:
T/T,D/A,D/P
Supply Ability:
50 tons per Month
Περιγραφή του προϊόντος
Ultra-Soft Two-Component Silicone Gel for IGBT Module Encapsulation HN-6607A/B (product series) is a very soft, low-crosslink-density two-component addition-cure silicone gel supplied as a 1:1 (A:B) liquid system by weight. Before cure it is a low-viscosity transparent liquid that pours easily and penetrates tight gaps; after cure it forms an ultra-soft, stress-free gel. The cured gel delivers outstanding dielectric insulation over a wide range of temperature and humidity,
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Όλες οι κριτικές

I
I*y
India Aug 6.2026
Our technical department speaks highly of this silicone gel for electronics,very suitable for our flow maters; we have collaborated three times already and will continue to work together in the future.

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