Component A 25 kg plastic barrel, Component B 25 kg plastic barrel; 50 kg kit per set
Delivery Time:
3-4 days
Payment Terms:
T/T,D/A,D/P
Supply Ability:
50 tons per Month
제품 설명
Ultra-Soft Two-Component Silicone Gel for IGBT Module Encapsulation HN-6607A/B (product series) is a very soft, low-crosslink-density two-component addition-cure silicone gel supplied as a 1:1 (A:B) liquid system by weight. Before cure it is a low-viscosity transparent liquid that pours easily and penetrates tight gaps; after cure it forms an ultra-soft, stress-free gel. The cured gel delivers outstanding dielectric insulation over a wide range of temperature and humidity,
Our technical department speaks highly of this silicone gel for electronics,very suitable for our flow maters; we have collaborated three times already and will continue to work together in the future.
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평점 스냅샷
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