Ultra-Soft Two-Component 1:1 Silicone Gel Potting Compound for IGBT Module Encapsulation Protection

Ultra-Soft Two-Component Silicone Gel for IGBT Module Encapsulation

HN-6607A/B (product series) is a very soft, low-crosslink-density two-component addition-cure silicone gel supplied as a 1:1 (A:B) liquid system by weight. Before cure it is a low-viscosity transparent liquid that pours easily and penetrates tight gaps; after cure it forms an ultra-soft, stress-free gel. The cured gel delivers outstanding dielectric insulation over a wide range of temperature and humidity, together with excellent moisture-proofing and sealing performance.

Key Features

• Ultra-soft, low-crosslink-density gel for stress-free protection of delicate components
• Low viscosity before cure for easy pouring and deep penetration
• Excellent dielectric insulation over wide temperature and humidity ranges
• Good moisture-proofing, waterproofing and sealing performance
• Convenient 1:1 mix ratio by weight for easy processing
• Medium-temperature cure; cure time adjustable by varying the cure temperature

Typical Applications

• Potting and protection of IGBT modules and power electronic modules
• Stress-free encapsulation of delicate electronic components
• Sensors and precision devices sensitive to mechanical stress
• Applications requiring excellent moisture sealing and dielectric insulation
• Electronic modules operating over wide temperature and humidity ranges

Technical Data

Mixing & Application Instructions

1. Pre-mix: stir Component A thoroughly before use; shake Component B well in its sealed container.
2. Adhesion check: confirm compatibility and adhesion on a small sample when bonding to the substrate is required.
3. Weighing: accurately weigh Components A and B in a 1:1 ratio by weight using a precision electronic scale.
4. Mixing: mix A and B thoroughly until uniform; scrape container walls and bottom for full dispersion.
5. Pouring / Potting: pour the mixed compound into the clean, dry device within the pot life.
6. Curing: allow to cure per the recommended schedule; do not move or stress the part during cure.

Recommended Curing Schedule

Packaging

Storage & Shelf Life

• Store in original, tightly sealed containers in a cool, dry, well-ventilated area.
• Recommended storage temperature: below 25 °C.
• Protect from direct sunlight, moisture and extreme temperatures.
• Shelf life: 6 months from date of manufacture when stored as recommended.
• Transportation: classified as non-dangerous goods (general chemicals).

Precautions

• For industrial / professional use only. Wear nitrile gloves, safety goggles and protective clothing; avoid skin and eye contact.
• Ensure adequate ventilation in the work area. Do not ingest.
• Cure inhibition warning: this addition-cure silicone may fail to cure in contact with organotin / tin-containing silicones, sulfur or polysulfide compounds, amines, polyurethane rubber, ammonia-containing items, phosphorous compounds, acidic substances and solder flux residues. Ensure all substrates and tools are clean and free of these contaminants.
• Keep containers tightly sealed when not in use. Store away from food, children and incompatible materials.