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Ip68 Bulk Thermal Silicone Molding Compound Gel Liquid For Ignition Coils Electronic Modules

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Thermally Conductive Potting Compound

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Ip68 Bulk Thermal Silicone Molding Compound Gel Liquid For Ignition Coils Electronic Modules

Brand Name:	Hanast
Model Number:	HN-6607AB
MOQ:	1kg
Price:	Negotiable
Packaging Details:	25KG/barrel
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Guangdong, China

Certification:

ROHS SGS

Name:

Liquid Silicone Gel For Electronics

Keyword:

Electrical Insulation Silicone Gel

Waterproof:

Type:

Ab Gel Silicone,2 Parts

Application:

AC Capacitors, Negative Ion Generators, Aquarium Water Pumps, Ignition Coils

Feature:

Electrical Insulation，low-viscosity，soft And Clear

Highlight:

Bulk silicone molding compound

silicone molding compound Liquid

bulk thermal compound Liquid

Product Description

1:1 Soft Silicone Compound For Ignition Coils Electronic Modules LED Ip68 Silicone Gel Transparent Liquid Ab Component Gel For Protective Electronic Potting Adhesive

Product Description:

This product is a very soft, low crosslinking density addition silicone rubber. It is a low-viscosity liquid before vulcanization. After vulcanization, in addition to the general characteristics of addition silicone rubber, it has good shock absorption, moisture resistance and sealing due to its soft nature. properties and excellent dielectric insulation properties over a wide range of temperature and humidity.

Product Features:

1. Medium temperature curing, the curing time can be adjusted according to different temperatures;

2. It is low-viscosity silicone oil before curing and gel elastomer after curing.

Product application:

The main application areas are the potting of electronic and electrical components and electrical assemblies. It is also used in occasions such as the potting of temperature sensors; it is used for the packaging of electronic transformers, AC capacitors, negative ion generators, aquarium water pumps, ignition coils, electronic modules, LED modules, etc.

Ip68 Bulk Thermal Silicone Molding Compound Gel Liquid For Ignition Coils Electronic Modules 0

Characteristics before curing
Component	Component A	Component B
Color	Transparent liquid	Transparent liquid
viscosity(cp s. 25℃)	800～2000	800～1800
Relative density(mpa•s)	1 ．0～1.12	0.98～1.02
The mixing ratio	A:B=1:1
Viscosity after mixing(cp s. 25℃)	800～1500
Operate Time (25℃)	2 h
Penetration (1/10mm)	200~ 400
Curing conditions (120℃)	20~30 mins
Cured properties Hardness(Shore A, 24hr)	0～10

Instructions:

1. Before mixing, component A needs to be properly stirred manually or mechanically, and component B should be fully shaken in a sealed state before use.

2. When it needs to be attached to the application material, please confirm whether it can be attached before use, and then apply it. 3. Before construction, please weigh and mix according to the weight ratio of A:B = 1:1, and stir thoroughly before applying glue.

Tags:

electronic silicone gel

electronic potting gel

silicone gel rubber

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