Product Overview for silicone potting compound:
Technical Parameters for silicone potting compound:
Color:Black / Grey / White (Customizable)
Mixing Ratio:1:1 (By Weight)
Packing:10kg/Set (5kg A+5kg B), 20kg/Set, 50kg/Set
Hardness:45±5 Shore A
Temperature Resistance:-50℃ ~ +250℃
Viscosity:2500-3000 mPa·s
Thermal Conductivity:≥0.76 W/m·K
Application:Electronic Ballasts, Power Supplies, Relays, PCB Boards, LED Drivers
Product Applications for silicone potting compound:
Automotive Electronics:Engine Control Units (ECU), transmission controllers, sensors.
Outdoor Communications:5G base station radio units, outdoor communication equipment power supplies.
Aerospace:Avionics, navigation system modules.
Industrial Harsh Environments:Actuators near heat sources, controllers used in arctic/tropical climates.
Usage Instructions for silicone potting compound:
Users must strictly follow standard operating procedures (SOP) during application. Given the unique demands of extreme environments, we strongly recommend conducting rigorous, system-level environmental reliability testing prior to mass deployment, ensuring the long-term integrity of the end product.
Method of Application
1. When used, mix A and B components evenly, and then weigh A and B components according to proportion. Mix thoroughly and evenly with a clean stirring device in a clean container, and then potting can be done. It can also be sealed under a vacuum after removing the bubbles.
2. The surface of the potting element needs to be cleaned. If the potting product is too large, it is recommended to potting in stages and then cure at room temperature (4-12hr) or by heating (80ºC-0.5hr).
3. For the automatic potting production line, in order to ensure accurate mixing ratio of A and B, Part A and Part B should be vacuumed respectively to remove the bubbles (the foaming time is 5-10 minutes), and then A and B should be pumped to the static mixer in proportion with a metering pump, and then potting can be done after mixing evenly.
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