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Waterproof And Moisture Resistant Silicone Potting Compound For Smart Devices

Waterproof And Moisture Resistant Silicone Potting Compound For Smart Devices

製品の詳細:
起源の場所: 広東省、中国
ブランド名: Hanast
証明: FDA/ROHS/REACH
モデル番号: HN-8806A/B
詳細情報
起源の場所:
広東省、中国
ブランド名:
Hanast
証明:
FDA/ROHS/REACH
モデル番号:
HN-8806A/B
動作温度範囲:
-50℃~+250℃
水吸収 (24時間):
0.01~0.02%
硬度(ショアA):
45±5
熱膨張係数 (CTE):
210μm/(m・℃)
熱伝導率:
≥0.76 W/m・K
ハイライト:

High Light

ハイライト:

waterproof silicone potting compound

,

moisture resistant potting material

,

silicone potting compound for smart devices

取引情報
最小注文数量:
1KG
価格:
交渉可能
パッケージの詳細:
50KG/セット、25KG/バー
受渡し時間:
5-7日
支払条件:
T/T、ペイパル
供給の能力:
100トン/月
製品説明

Waterproof And Moisture Resistant Silicone Potting Compound For Smart Devices

 

Product Overview for silicone potting compound:

Engineered for extreme climates, HN-8806 delivers exceptional performance stability across a wide temperature range of -50°C to +250°C. It retains its native elasticity without cracking or degrading under severe thermal stress. This resilient formula provides unmatched, long-term reliability for critical components in the automotive, aerospace, and outdoor equipment industries.

 

Technical Parameters for silicone potting compound:

Color:Black / Grey / White (Customizable)

Mixing Ratio:1:1 (By Weight)

Packing:10kg/Set (5kg A+5kg B), 20kg/Set, 50kg/Set

Hardness:45±5 Shore A

Temperature Resistance:-50℃ ~ +250℃

Viscosity:2500-3000 mPa·s

Thermal Conductivity:≥0.76 W/m·K

Application:Electronic Ballasts, Power Supplies, Relays, PCB Boards, LED Drivers

 

Product Applications for silicone potting compound:

Automotive Electronics:Engine Control Units (ECU), transmission controllers, sensors.

Outdoor Communications:5G base station radio units, outdoor communication equipment power supplies.

Aerospace:Avionics, navigation system modules.

Industrial Harsh Environments:Actuators near heat sources, controllers used in arctic/tropical climates.

 

 

 

Usage Instructions for silicone potting compound:

Users must strictly follow standard operating procedures (SOP) during application. Given the unique demands of extreme environments, we strongly recommend conducting rigorous, system-level environmental reliability testing prior to mass deployment, ensuring the long-term integrity of the end product.

 

 

 

Method of Application

1. When used, mix A and B components evenly, and then weigh A and B components according to proportion. Mix thoroughly and evenly with a clean stirring device in a clean container, and then potting can be done. It can also be sealed under a vacuum after removing the bubbles.

2. The surface of the potting element needs to be cleaned. If the potting product is too large, it is recommended to potting in stages and then cure at room temperature (4-12hr) or by heating (80ºC-0.5hr).

3. For the automatic potting production line, in order to ensure accurate mixing ratio of A and B, Part A and Part B should be vacuumed respectively to remove the bubbles (the foaming time is 5-10 minutes), and then A and B should be pumped to the static mixer in proportion with a metering pump, and then potting can be done after mixing evenly.

 

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