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Low Shrinkage Silicone Potting Compound For Precision Electronic Packaging

Low Shrinkage Silicone Potting Compound For Precision Electronic Packaging

Dettagli del prodotto:
Luogo di origine: Guangdong, Cina
Marca: Hanast
Certificazione: ROHS
Numero di modello: HN-8806A/B
Informazioni dettagliate
Luogo di origine:
Guangdong, Cina
Marca:
Hanast
Certificazione:
ROHS
Numero di modello:
HN-8806A/B
Durata in vaso (@25°C):
0,3-0,4 ore
Indurimento iniziale (@25°C):
2-3 ore
Polimerizzazione completa (@25°C):
4-12 ore o (@80°C): 0,2 ore
Durezza (Shore A):
45±5
Viscosità:
2000-3000 mPa·S (A&B)
Rapporto di miscelazione:
1:1 (in peso o volume)
Evidenziare:

High Light

Evidenziare:

low shrinkage silicone potting compound

,

precision electronic packaging silicone

,

silicone potting compound with warranty

Informazioni di trading
Quantità di ordine minimo:
1KG
Prezzo:
Negoziabile
Imballaggi particolari:
50 kg/set, 25 kg/barra
Tempi di consegna:
5-7 giorni
Termini di pagamento:
T/T, PayPal
Capacità di alimentazione:
100ton/mese
Descrizione del prodotto

Low Shrinkage Silicone Potting Compound For Precision Electronic Packaging

 

 

Product Overview for silicone potting compound:

HN-8806, two-component addition type silicone potting rubber which can be cured into high-performance elastomer by room temperature or heating. This potting silicone rubber has excellent electrical insulation, high moisture resistance, and a wide temperature range of -50°C to 250°C. Low-viscosity potting compound that Will cure in deep sections. Low shrinkage rate after curing, will not emit heat and by-products, no corrosion for filling and sealing components. No pollution in the surrounding environment, Complying with RoHs standards. Its good thermal conductivity function can effectively transfer the heat emitted by the electronic components.

 

Key Features for silicone potting compound:

1.Fast Initial Cure (2-3hr 25°C) 

2.Heat Acceleration Possible 

3.Suitable Pot Life 

4.Good Flowability 

5.1:1 Mix Ratio.

 

 

 

Technical Parameters for silicone potting compound:

2-3 hours 0.3-0.4 hours
Initial Cure (25°C) 2-3 hours
Full Cure (25°C) 4-12 hours or (80°C): 0.2 hours
Hardness (Shore A) 45±5
Viscosity 2000-3000 mPa·S (A&B)
Mixing Ratio 1:1 (by weight or volume)

 

 

Product Applications for silicone potting compound:

1.Consumer Electronics: Protects power adapters, smart home controllers, and power bank PCBs.

2.Low/Medium-Volume Manufacturing: Adapts to R&D pilot runs, small-batch orders, and repair/rework.

3.Fast-Paced Production Lines: Optimizes electronics potting for high-throughput, quick-turnaround schedules.

 

Usage Instructions for silicone potting compound:

1. When used, mix A and B components evenly, and then weigh A and B components according to proportion. Mix thoroughly and evenly with a clean stirring device in a clean container, and then potting can be done. It can also be sealed under a vacuum after removing the bubbles.

2. The surface of the potting element needs to be cleaned. If the potting product is too large, it is recommended to potting in stages and then cure at room temperature (4-12hr) or by heating (80ºC-0.5hr).

3. For the automatic potting production line, in order to ensure accurate mixing ratio of A and B, Part A and Part B should be vacuumed respectively to remove the bubbles (the foaming time is 5-10 minutes), and then A and B should be pumped to the static mixer in proportion with a metering pump, and then potting can be done after mixing evenly.

 

 

Packaging & Storage for silicone potting compound:

10KG / Set (A, 5kg + B, 5kg) 20KG / Set (A, 10kg + B, 10kg) 50KG / Set (A, 25kg + B, 25kg)

Storage and transportation:This product is non-toxic non-dangerous goods, according to the general chemical handling, stored in a cool & dry place (room temperature).

 

 

FAQ for silicone potting compound:

Q: Can the part be moved after initial cure?

A: Yes, after initial cure, the part has sufficient strength for careful handling and light subsequent operations.

Q: How can I cure it faster?

A: Heating at 80°C for 0.2 hours (approx. 12 mins) achieves full cure.

Q: Does the compound harden immediately after the pot life?

A: No, it begins to thicken and enter the curing stage gradually, but completion within the pot life is recommended.

Q: Does fast curing mean a shorter shelf life?

A: No, cure speed and shelf life are separate. The unmixed components have a 6-month shelf life.

Q: Can heat curing damage my components?

A: 80°C is safe for most components. Evaluate or choose room temperature cure if extremely heat-sensitive parts are present.

 

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