Low Modulus Dielectric Silicone Gel for IGBT Power Module Encapsulation HN-6607 A/B is a two-component, 1:1 addition-cure silicone gel formulated with an ultra-low modulus and high dielectric strength for stress-free encapsulation of IGBT power modules, power electronics and other sensitive circuitry. The transparent, self-healing jelly remains flexible over the full service life and protects delicate solder joints, bond wires and sensors from mechanical and thermal stress.
Our technical department speaks highly of this silicone gel for electronics,very suitable for our flow maters; we have collaborated three times already and will continue to work together in the future.
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