logo
Home > Products >
Electronic Silicone Gel
>
Ecu Thermal Electronic Silicone Gel Liquid Waterproof Potting For Electronics

Ecu Thermal Electronic Silicone Gel Liquid Waterproof Potting For Electronics

Product Details:
Place of Origin: Guangdong, China
Brand Name: Hanast
Certification: ROHS SGS
Model Number: HN-6607AB
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
Hanast
Certification:
ROHS SGS
Model Number:
HN-6607AB
Curing Conditions (120℃):
20-30mins
Operate Time (25℃):
2h
The Mixing Ratio:
A:B=1:1
Component:
ComponentA And ComponentB
Application:
Load Cell Junction Box PCB Circuit Board
Feature1:
High Transparent Thermal Conductivity Insulating
Name:
Silicone Gel
Color:
Transparent
Feature2:
Low-viscosity
Highlight:

High Light

Highlight:

Thermal electronic silicone gel

,

Potting electronic silicone gel

,

liquid silicone gel for electronics

Trading Information
Minimum Order Quantity:
1kg
Price:
Negotiable
Packaging Details:
25KG/barrel
Payment Terms:
T/T, D/P, D/A
Product Description

Ecu Liquid Silicone Gel Transparent For Load Cell Junction Box PCB Waterproof Potting Silicone Thermal Gel For Circuit Board Electrical Insulation

 

Product Description:

This product is a very soft, low crosslinking density addition silicone rubber. It is a low-viscosity liquid before vulcanization. After vulcanization, in addition to the general characteristics of addition silicone rubber, it has good shock absorption, moisture resistance and sealing due to its soft nature. properties and excellent dielectric insulation properties over a wide range of temperature and humidity.

Product Features:

1. Medium temperature curing, the curing time can be adjusted according to different temperatures;

2. It is low-viscosity silicone oil before curing and gel elastomer after curing.

 

Characteristics before curing
Component
Component A
Component B
Color
Transparent liquid
Transparent liquid
viscosity(cp s. 25℃)
800~2000
800~1800
Relative density(mpa•s)
1 .0~1.12
0.98~1.02
The mixing ratio
A:B=1:1
Viscosity after mixing(cp s. 25℃)
800~1500
Operate Time (25℃)
2 h
Penetration (1/10mm)
200~ 400
Curing conditions (120℃)
20~30 mins
Cured properties
Hardness(Shore A, 24hr)
0~10

 

Ecu Thermal Electronic Silicone Gel Liquid Waterproof Potting For Electronics 0

Instructions:

1. Before mixing, component A needs to be properly stirred manually or mechanically, and component B should be fully shaken in a sealed state before use.

2. When it needs to be attached to the application material, please confirm whether it can be attached before use, and then apply it. 3. Before construction, please weigh and mix according to the weight ratio of A:B = 1:1, and stir thoroughly before applying glue.