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10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board

10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board

Brand Name: Hanast
Model Number: HN-8808AB
MOQ: 1kg
Price: Negotiable
Packaging Details: 25KG/barrel
Payment Terms: T/T
Detail Information
Place of Origin:
Guangdong, China
Certification:
ROHS SGS
Name:
10:1 Silicone Potting Glue
Feature:
Non-toxic, Odorless, Non-corrosive, Non-swelling
Appearance:
Liquid
Mix Ratio:
10:1
Sample:
Can Be Offered
Application:
Automotive Electronic Modules, Electrical Appliances
Highlight:

Vulcanizing Silicone Potting Compound

,

Room Temperature Silicone Potting Compound

,

Potting room temperature vulcanizing

Product Description

Two-Component 10:1 Potting Compound For Sealing Circuit Board Led Module Power Potting Protecting Non-Corrosive Low Viscosity Potting Compound

 

PRODUCT DESCRIPTION

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board 0

Main Application

It is mainly used in circuit boards, LED power supplies, waterproof power supplies, automotive electronic modules, electrical appliances, light sources, lamps, and their accessories for potting protection. Especially for potting with adhesive requirements on aluminum substrates.

10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board 1

Main Feature:

1. This potting silicone rubber has high moisture resistance and a wide temperature range of - 57°C to 250°C.

2. Condensed liquid silicone rubber does not use polar compounds as raw materials, and does not release by-products during cross-linking, and can maintain better electrical properties under harsh conditions.

3. Non-toxic, odorless, non-corrosive, non-swelling.

4. It has adhesive force, has adhesion to metal aluminum, iron, acrylic, and PC plastic, and can improve waterproof sealing performance.

 

Before Mixing
  A B
Exterior black liquid Transparent liquid
Base chemical composition Polysiloxane Polysiloxane
Viscosity (cP) (GB/2794-1995) 2000-2800 20-30
Density (g/cm³) (GB/2794-1995) 1.42±0.02 -
A+B after mixing
Exterior black liquid
Base chemical composition Polysiloxane (Silicone)
Viscosity (cP) (GB/2794-1995) 2000-2600mpa's
Density (g/cm³) (GB/2794-1995) 1.40±0.02
Operating time (25℃, min) 40-60
Curing time (25℃, h) 4-6
Hardness (shore A) (GB/T531-1999) 30-40
Volume resistivity Ω·cm (GB/T 31838.2-2019) ≥5.0×10 14
Thermal conductivity (W/M▪K) (GB/T 38712-2020) 0.5±0.1
Dielectric strength (kv/mm) ≥14
Dielectric constant ≤3.5
Elongation at break (%) ≤100%

 

HOW TO USE

 

​​ According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).

 

Good price  online

Products Details

Home > Products >
Silicone Potting Compound
>
10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board

10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board

Brand Name: Hanast
Model Number: HN-8808AB
MOQ: 1kg
Price: Negotiable
Packaging Details: 25KG/barrel
Payment Terms: T/T
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
Hanast
Certification:
ROHS SGS
Model Number:
HN-8808AB
Name:
10:1 Silicone Potting Glue
Feature:
Non-toxic, Odorless, Non-corrosive, Non-swelling
Appearance:
Liquid
Mix Ratio:
10:1
Sample:
Can Be Offered
Application:
Automotive Electronic Modules, Electrical Appliances
Minimum Order Quantity:
1kg
Price:
Negotiable
Packaging Details:
25KG/barrel
Payment Terms:
T/T
Highlight:

Vulcanizing Silicone Potting Compound

,

Room Temperature Silicone Potting Compound

,

Potting room temperature vulcanizing

Product Description

Two-Component 10:1 Potting Compound For Sealing Circuit Board Led Module Power Potting Protecting Non-Corrosive Low Viscosity Potting Compound

 

PRODUCT DESCRIPTION

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board 0

Main Application

It is mainly used in circuit boards, LED power supplies, waterproof power supplies, automotive electronic modules, electrical appliances, light sources, lamps, and their accessories for potting protection. Especially for potting with adhesive requirements on aluminum substrates.

10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board 1

Main Feature:

1. This potting silicone rubber has high moisture resistance and a wide temperature range of - 57°C to 250°C.

2. Condensed liquid silicone rubber does not use polar compounds as raw materials, and does not release by-products during cross-linking, and can maintain better electrical properties under harsh conditions.

3. Non-toxic, odorless, non-corrosive, non-swelling.

4. It has adhesive force, has adhesion to metal aluminum, iron, acrylic, and PC plastic, and can improve waterproof sealing performance.

 

Before Mixing
  A B
Exterior black liquid Transparent liquid
Base chemical composition Polysiloxane Polysiloxane
Viscosity (cP) (GB/2794-1995) 2000-2800 20-30
Density (g/cm³) (GB/2794-1995) 1.42±0.02 -
A+B after mixing
Exterior black liquid
Base chemical composition Polysiloxane (Silicone)
Viscosity (cP) (GB/2794-1995) 2000-2600mpa's
Density (g/cm³) (GB/2794-1995) 1.40±0.02
Operating time (25℃, min) 40-60
Curing time (25℃, h) 4-6
Hardness (shore A) (GB/T531-1999) 30-40
Volume resistivity Ω·cm (GB/T 31838.2-2019) ≥5.0×10 14
Thermal conductivity (W/M▪K) (GB/T 38712-2020) 0.5±0.1
Dielectric strength (kv/mm) ≥14
Dielectric constant ≤3.5
Elongation at break (%) ≤100%

 

HOW TO USE

 

​​ According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).