HN-8820 A/B Silicone Potting | High Insulation | 2.0 W/M·K | Fast Curing

HN-8820 A/B Silicone Potting | High Insulation | 2.0 W/m·K | Fast Curing

Product Overview for Thermally Conductive Potting Compound:

HN-8820 A/B silicone potting system offers high insulation and 2.0 W/m·K thermal conductivity. It cures quickly with heat, speeding up your production cycle.

Performance Highlights for Thermally Conductive Potting Compound

•Fast heat cure option

•Excellent dielectric properties

•Good thermal stability

•User-friendly 1:1 ratio

Technical Parameters for Thermally Conductive Potting Compound:

• Hardness: 45–50 Shore A

• Thermal Conductivity: 2.0 W/m·K

• Cure @ 80°C: 10–20 min

• Resistivity: ≥5.0×10¹⁴ Ω·cm

Applications for Thermally Conductive Potting Compound:

• Power electronics

• Automotive sensors

• LED arrays

• Industrial PCs

• 

Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.

Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.

Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.

FAQ for Thermally Conductive Potting Compound:

Q: How fast does it cure with heat?
A: 10–20 minutes at 80°C.

Q: Is it electrically insulating?
A: Very high insulation resistance.

Q: Can it be used for shock absorption?
A: Yes, it has rubbery elasticity.

Q: Does it outgas during cure?
A: Minimal if degassed properly.

Q: Is technical support available?
A: Yes, our engineers can assist.