Fire Retardant High Temp Potting Epoxy Resin Industrial Sensors Lithium Battery Packs Inverters Epoxy Potting Glue
Product Description of epoxy potting compound:
Epoxy potting compound is a high-performance insulating and sealing material, mainly used to protect electronic components through potting, filling, or encapsulation, and cured at room temperature or by heating.
Epoxy potting compound is a thermosetting polymer sealant made from epoxy resin as a matrix, with the addition of curing agents, fillers, and additives. Its core characteristic is that it is poured into electronic components or devices in a liquid state, and then cures through a chemical reaction to form a hard, dense solid protective layer, achieving comprehensive encapsulation of internal components.
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Product Features of epoxy potting compound:
With low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation, compressive resistance, and bonding strength
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Physical Properties of epoxy potting compound:
| efore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
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processabili
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mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
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| Volume resistance ofΩ-cm |
15 1.1*10 |
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| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
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distortion temperature ℃ |
130-150 |
| low temperature resistant ℃ | -30 |
Product application of epoxy potting compound
HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high voltage packs, aquarium equipment, anion generators
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Package of epoxy potting compound:
This product is 40KG per group;
Component A is 20KG (in barrels), and Component B is 20KG (in barrels)
About our company
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