High Strength Epoxy Potting Compound For Rigid Electronic Component Protection

High Strength Epoxy Potting Compound For Rigid Electronic Component Protection

Product profile:

HN-5508 Epoxy Potting Compound at roomtemperature or low temperature, with low viscosity, longoperating time, good fluidity, and easy penetration intothe clearance of the product; no bubbles after curing,smooth surface, luster, high hardness; curing materialshave good acid and alkali resistance, moisture-proof,moisture and air aging; curing materials have excellentinsulation, compressive resistance and bonding strength.Any electronic or other products that require perfusionsealing, packaging protection, insulation and moistureresistance can be used.

Characteristic

1. Excellent physical and chemical stability, with a wide operating temperature range from -60℃ to 230℃.

2. Low viscosity for easy application. Free of solid fillers and fully transparent, allowing clear observation of sealed parts.

3. Reworkable and reusable. It features high flexibility and ultra-low shrinkage.

4. Delivers reliable protection against dust, moisture and vibration, along with superior electrical insulation.

5. The cured surface is naturally tacky, ensuring strong adhesion to most substrates without primer.

6. Cures either at room temperature or under heat. Curing accelerates with rising temperature, enabling flexible adjustment of curing time.

 
Product Description
This product is a very soft, low cross-linking density addition silicone rubber. It is a low-viscosity liquid before vulcanization. After vulcanization, in addition to the general characteristics of addition silicone rubber, it has good shock absorption, moisture resistance and sealing due to its soft nature. properties and excellent dielectric insulation properties over a wide range of temperature and humidity.

Product Features:

1. Features moderate-temperature curing. Its curing cycle can be flexibly regulated by temperature.

2. The material exists as low-viscosity silicone oil before curing, and transforms into a gel-like elastomer upon curing.

 
Storage and transportation:
1. Store in a cool and dry place with a storage periodof 6 months (25°C below).
2. Products beyond the storage period should beconfirmed whether there are any abnormalities beforebeing used.
3. Parts A and B of the colloid must be sealed andpreserved, with careful leakage during transportation!
4. This kind of products are non-dangerous goodsand can be transported as general chemicals.

Matters need attention:

1. This product is AB agent, according to the labelratio on the product package, and the mixing ratio isweight ratio and non-volume ratio
2, AB agent can not be mixed with a round barwithout resistance, must be stirred with a flat tool withresistance, it is best to use a small mixer.
3. This product should be placed in a cool and dryplace to avoid light, keep the workshop dust-free, andcover the unused glue in time.
4. The performance test data is the test result whenthe humidity is 60% and the temperature is 25°C, forcustomer reference only.
5, Epoxy Potting Compound stored in a wetenvironment will appear crystallization phenomenon,please put in the oven at low temperature hot drying,restore its original state.

Package:

This product is 40KG per group;

Component A is 20KG (in barrels), and Component B is 20KG (in barrels)