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Low Shrinkage Epoxy Potting Compound For Precision PCB Assembly Encapsulation

Low Shrinkage Epoxy Potting Compound For Precision PCB Assembly Encapsulation

Product Details:
Place of Origin: china
Brand Name: Hanast
Certification: Rohs/Reach
Model Number: HN-5508A/B
Detail Information
Place of Origin:
china
Brand Name:
Hanast
Certification:
Rohs/Reach
Model Number:
HN-5508A/B
Wide Temperature Range:
-50℃-200℃
Keyword:
Epoxy Potting Compound
Exterior:
Liquid
Thermal Conductivity:
0.5 W/mK
Cure Time:
12 Hours(Customizable)
Mixing Ratio:
5:1
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low shrinkage epoxy potting compound

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precision PCB encapsulation epoxy

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epoxy potting compound for PCB

Trading Information
Minimum Order Quantity:
1KG
Price:
Negotiable
Packaging Details:
25KG/bar
Delivery Time:
5-7days
Payment Terms:
T/T、paypal
Supply Ability:
200ton/month
Product Description

Product Description:

HN-5508 Epoxy Potting Compound cures at room or low temperature. Featuring low viscosity, long pot life and superior fluidity, it easily penetrates tiny gaps of products. The cured material is bubble-free with a smooth, glossy surface and high hardness. It also delivers great acid & alkali resistance, moisture resistance and anti-aging performance. Additionally, it boasts excellent electrical insulation, compression resistance and bonding strength. This product is widely applicable for potting, sealing, encapsulation, insulation and moisture protection of electronic devices and other related products.

 

Features:

1. Cures at room or low temperature, requiring no heating equipment for easy application.

2. Low viscosity and great fluidity allow full penetration into tiny gaps.

3. Cured material is bubble-free, smooth, glossy and high in hardness.

4. Excellent acid & alkali resistance, moisture proofness and anti-aging performance.

5. Superior insulation, compression resistance and bonding strength for component protection.

 

Technical Parameters:

Cure Time 12 Hours (Customizable)
Mixing Ratio 5:1
Keyword Epoxy Potting Compound
Hardness After Cure 75±5 Shore A
Thermal Conductivity 0.5 W/mK
Exterior Liquid
Viscosity After Mixing 1000 CPS
Temperture resistance -40~120°C

 

 

 

Applications:

HN-5508 is widely used for transformers, resistors,filters,temperature sensors, temperature controllers, andpoint wires ring, high pressure package, aquariumequipment, anion generator, ultrasonic atomizer,electronic and electrical appliances and othercomponents requiring insulation, flame retardant andtemperature resistance. It has flame retardant insulation,sealing bonding, moisture-proof earthquake resistance,temperature resistance and other main functions.

 

Customization:

  • Brand: Hanast
  • Model: HN-5508A/B
  • Origin: China
  • Certifications: RoHS, REACH
  • MOQ: 1 kg
  • Price: Negotiable
  • Package: 25 kg per drum
  • Lead Time: 5–7 working days
  • Payment Terms: T/T, PayPal
  • Monthly Supply Capacity: 200 tons
  • Flame Retardancy: UL-94 V0
  • Appearance: Liquid
  • Key Features: Waterproof, moisture-proof, heat dissipation, anti-vibration
  • Product Type: Potting Compound

 

  • Water Resistance: Excellent performance
  •  

    Support and Services:

    The Product Technical Support and Services for the Silicone Potting Compound include:

    - Comprehensive guidance on product usage and application

    - Troubleshooting assistance for any issues that may arise during potting process

    - Recommendations on potting techniques and best practices

    - Information on product compatibility with various materials

    - Assistance with selecting the right potting compound for specific applications

     

    Packing and Shipping:

    This product is 30 KG per group; including group A25 KG (barrel) and group B 5 KG (pot)

     

     

     

    Low Shrinkage Epoxy Potting Compound For Precision PCB Assembly Encapsulation 0Low Shrinkage Epoxy Potting Compound For Precision PCB Assembly Encapsulation 1