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High Thermal Conductivity Epoxy Potting Compound For Power Module Heat Management

High Thermal Conductivity Epoxy Potting Compound For Power Module Heat Management

Product Details:
Place of Origin: Guangdong, China
Brand Name: Hanast
Certification: ROHS,SGS
Model Number: HN-6607A/B
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
Hanast
Certification:
ROHS,SGS
Model Number:
HN-6607A/B
The Mixing Ratio:
A:B=1:1
Viscosity After Mixing(cp S. 25℃):
800~1500
Operate Time (25℃):
2 H
Penetration (1/10mm):
200-400
Curing Conditions (120℃):
20~30min
Cured Properties Hardness(Shore A, 24hr):
0~10
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Trading Information
Minimum Order Quantity:
1 kilogram
Price:
Negotiable
Packaging Details:
25KG/ Iron Drum
Delivery Time:
5-7days
Payment Terms:
T/T
Product Description

High Thermal Conductivity Epoxy Potting Compound For Power Module Heat Management

Characteristic

Outstanding physical and chemical stability. Working temperature ranges from -60℃ to 230℃.

Low viscosity for easy application. Free of solid fillers and fully transparent, enabling clear observation of encapsulated parts.

Repairable and reusable. Features high flexibility and ultra-low shrinkage.

Delivers excellent protection against dust, moisture and vibration, along with reliable electrical insulation.

Forms a naturally tacky surface after curing. It adheres firmly to most substrates without primer.

Cures at room temperature or under heating. Curing speed increases with temperature, and curing time is fully adjustable.

 
Product Description:
This product is a soft addition silicone rubber with low cross-link density. It comes as low-viscosity liquid before curing. After vulcanization, it retains all typical advantages of addition silicone rubber. Its ultra-soft texture delivers outstanding shock absorption, moisture resistance and sealing performance, as well as reliable dielectric insulation across wide temperature and humidity ranges.


 

Product Features:
1. Medium temperature curing, the curing time can be adjusted according to different temperatures;
2. It is low-viscosity silicone oil before curing and gel elastomer after curing.


 

 
Instructions:

Prior to mixing, stir Component A thoroughly by hand or with mechanical tools. Keep Component B sealed and shake it well before use.

Perform an adhesion test on the substrate before full application.

Mix Component A and Component B at a 1:1 weight ratio. Stir the mixture completely before dispensing.


 

Package:

Each set weighs 40 kg in total, including 20 kg of Component A and 20 kg of Component B, both packed in drums.


Storage and transportation:
1,Store in a cool and dry place. The storage period is 6 months (at 25℃).
2, Products that have exceeded the shelf life should be confirmed for any abnormalities before use.
3,Components A and B of the colloid must be sealed and stored, and be careful of leakage during transportation!
4,Such products are non-dangerous goods and can be transported as general chemicals.

Customized jelly silicone, PCB circuit board silicone, electronic silicone,

High Thermal Conductivity Epoxy Potting Compound For Power Module Heat Management 1High Thermal Conductivity Epoxy Potting Compound For Power Module Heat Management 2